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• 宁波材料技术与工程研... [4]
• 力学研究所 [2]
• 金属研究所 [2]
• 过程工程研究所 [2]
• 重庆绿色智能技术研究... [1]
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• OAI收割 [14]

内容类型

• 期刊论文 [14]

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• 2023 [1]
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• Materials ... [2]
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浏览/检索结果: 共14条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Size- and temperature-dependent thermal transport across a Cu-diamond interface: Non-equilibrium molecular dynamics simulations 期刊论文  OAI收割 SURFACES AND INTERFACES, 2023, 卷号: 37, 页码: 102736 作者:  Huang, Hai;  Zhong, Yinghui;  Cai, Bin;  Wang, Jiefang;  Liu, Zhongxia   |  收藏  |  浏览/下载：67/0  |  提交时间：2023/06/15 Interfacial thermal transport  Cu -diamond composites  Size effects  Temperature effects  Non -equilibrium molecular dynamics   Role of interface on irradiation damage of Cu-diamond composites using classical molecular dynamics simulations 期刊论文  OAI收割 CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 12, 页码: 16813-16824 作者:  Jin, Yanan;  Huang, Hai;  Zhong, Yinghui;  Yuan, Xiaoting;  Li, Huan   |  收藏  |  浏览/下载：27/0  |  提交时间：2022/08/22 Thermal management materials  Cu-diamond interface  Displacement cascades  Irradiation tolerance  Molecular dynamics  Spacecraft electronics   Unconventional Doping Effect Leads to Ultrahigh Average Thermoelectric Power Factor in Cu3SbSe4-Based Composites 期刊论文  OAI收割 ADVANCED MATERIALS, 2022, 页码: 10 作者:  Huang, Yuling;  Zhang, Bin;  Li, Jingwei;  Zhou, Zizhen;  Zheng, Sikang   |  收藏  |  浏览/下载：22/0  |  提交时间：2022/08/22 carrier mobility  chalcopyrites  high power factor  thermoelectrics  unconventional doping   Coordinating mechanical performance and fire safety of epoxy resin via functionalized nanodiamond 期刊论文  OAI收割 DIAMOND AND RELATED MATERIALS, 2020, 卷号: 108, 页码: 12 作者:  Wang, Qi;  Zhang, Jing;  Shi, Wen;  Castillo-Rodriguez, Miguel;  Su, Dang Sheng   |  收藏  |  浏览/下载：15/0  |  提交时间：2021/02/02 Nanodiamond  Epoxy composite  Flame retardancy  Mechanical properties   Improved Figure of Merit of Cu2SnSe3 via Band Structure Modification and Energy-Dependent Carrier Scattering 期刊论文  OAI收割 ACS APPLIED MATERIALS & INTERFACES, 2020, 卷号: 12 作者:  Ming, Hongwei;  Zhu, Chen;  Qin, Xiaoying;  Zhang, Jian;  Li, Di   |  收藏  |  浏览/下载：14/0  |  提交时间：2020/11/26 thermoelectric properties  Cu2SnSe3  thermal conductivity  band structure modification  energy dependent carrier scattering   Thermal CVD growth of graphene on copper particles targeting tungsten-copper composites with superior wear and arc ablation resistance properties 期刊论文  OAI收割 DIAMOND AND RELATED MATERIALS, 2020, 卷号: 104 作者:  Dai, Dan;  Wu, Mingliang;  Shu, Shengcheng;  Yang, Ke;  Lin, Cheng-Te   |  收藏  |  浏览/下载：90/0  |  提交时间：2020/12/16 MECHANICAL-PROPERTIES  LAYER GRAPHENE  MICROSTRUCTURE  BEHAVIOR   Construction of 3D interconnected diamond networks in Al-matrix composite for high-efficiency thermal management 期刊论文  OAI收割 CHEMICAL ENGINEERING JOURNAL, 2020, 卷号: 380 作者:  Zhang, Long;  Wei, Qiuping;  An, Junjie;  Ma, Li;  Zhou, Kechao   |  收藏  |  浏览/下载：69/0  |  提交时间：2020/12/16 PHASE-CHANGE MATERIALS  COATED DIAMOND  DIAMOND/ALUMINUM COMPOSITES  CONDUCTIVITY ENHANCEMENT  AL/DIAMOND COMPOSITES  FOAM  FABRICATION  PARTICLES  MICROSTRUCTURE  PLASMA   Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 810, 页码: 7 作者:  Sun, Hong;  Guo, Lijiang;  Deng, Nan;  Li, Xiaoyu;  Li, Jiangtao   |  收藏  |  浏览/下载：89/0  |  提交时间：2019/11/12 Metal matrix composites  Electroplating  Sintering  Thermal conductivity   Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379 作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR   |  收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05 Al/diamond Composites  Thermal-conductivity  Coated Diamond  Heat Sinks  Densification  Microstructure  Mechanisms  Strength  Surface  Growth   Thermal conductivity and mechanical properties of flake graphite/copper composite with a boron carbide-boron nano-layer on graphite surface 期刊论文  OAI收割 COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2018, 卷号: 106, 页码: 42-51 作者:  Lv, D. J.;  Bai, H.;  Xue, C.;  Lyu, J. L.;  Li, J.   |  收藏  |  浏览/下载：25/0  |  提交时间：2018/12/04 Management Applications  Preferred Orientation  Cu/diamond Composites  Diamond Particles  Microstructure  Fabrication  Pretreatment  Interface  Expansion  Blocks