中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
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浏览/检索结果: 共212条,第1-10条 帮助

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基于机器学习的处理器验证高强度用例提取 学位论文  OAI收割
硕士, 北京: 中国科学院研究生院, 2022
作者:  
戚航
  |  收藏  |  浏览/下载:26/0  |  提交时间:2022/06/15
Super-enhancer-associated TMEM44-AS1 aggravated glioma progression by forming a positive feedback loop with Myc 期刊论文  OAI收割
Journal of Experimental & Clinical Cancer Research, 2021, 卷号: 40
作者:  
Bian,Erbao;  Chen,Xueran;  Cheng,Li;  Cheng,Meng;  Chen,Zhigang
  |  收藏  |  浏览/下载:59/0  |  提交时间:2021/11/15
Stitching Graphene Sheets with Graphitic Carbon Nitride: Constructing a Highly Thermally Conductive rGO/g-C3N4 Film with Excellent Heating Capability 期刊论文  OAI收割
ACS APPLIED MATERIALS & INTERFACES, 2021, 卷号: 13
作者:  
Wang, Yanyan;  Zhang, Xian;  Ding, Xin;  Li, Ya;  Wu, Bin
  |  收藏  |  浏览/下载:31/0  |  提交时间:2021/04/26
Numerical simulation and experimental study on the drilling process of 7075-t6 aerospace aluminum alloy 期刊论文  OAI收割
Materials, 2021, 卷号: 14, 期号: 3, 页码: 1-17
作者:  
Luo HT(骆海涛);  Fu J(富佳);  Wu TK(武廷课);  Chen N(陈宁);  Li HD(李华东)
  |  收藏  |  浏览/下载:12/0  |  提交时间:2021/02/14
Hybrid Three Dimensionally Printed Paper-Based Microfluidic Platform for Investigating a Cell's Apoptosis and Intracellular Cross-Talk 期刊论文  OAI收割
ACS SENSORS, 2020, 卷号: 5, 期号: 2, 页码: 464-473
作者:  
Liu, Ping;  Li, Bowei;  Fu, Longwen;  Huang, Yan;  Man, Mingsan
  |  收藏  |  浏览/下载:35/0  |  提交时间:2020/07/08
Planarization of backside emitting vcsel and method of manufacturing the same for array application 专利  OAI收割
专利号: US20190237936A1, 申请日期: 2019-08-01, 公开日期: 2019-08-01
作者:  
PAO, YI-CHING
  |  收藏  |  浏览/下载:12/0  |  提交时间:2019/12/30
Light-emitting device for an automotive vehicle headlamp lighting module and associated lighting module and headlamps 专利  OAI收割
专利号: US10281130, 申请日期: 2019-05-07, 公开日期: 2019-05-07
作者:  
SOMMERSCHUH, STEPHAN;  REDJEM SAAD, LOTFI
  |  收藏  |  浏览/下载:12/0  |  提交时间:2019/12/23
Self-alignment features for iii-v ridge process and angled facet die 专利  OAI收割
专利号: US20180358778A1, 申请日期: 2018-12-13, 公开日期: 2018-12-13
作者:  
BARWICZ, TYMON;  MARTIN, YVES C.;  ORCUTT, JASON S.
  |  收藏  |  浏览/下载:8/0  |  提交时间:2019/12/31
40×Retention Improvement by Eliminating Resistance Relaxation with High Temperature Forming in 28 nm RRAM Chip 会议论文  OAI收割
作者:  
Xu XX(许晓欣);  Tai L(台路);  Gong TC(龚天成);  Yin JH(殷嘉浩);  Peng Huang
  |  收藏  |  浏览/下载:34/0  |  提交时间:2019/05/13
Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die 专利  OAI收割
专利号: US10135224, 申请日期: 2018-11-20, 公开日期: 2018-11-20
作者:  
TSENG, CHUN-HAO;  KUO, YING-HAO;  YEE, KUO-CHUNG
  |  收藏  |  浏览/下载:12/0  |  提交时间:2019/12/23