中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
首页
机构
成果
学者
登录
注册
登陆
×
验证码:
换一张
忘记密码?
记住我
×
校外用户登录
CAS IR Grid
机构
金属研究所 [11]
上海微系统与信息技术... [2]
上海硅酸盐研究所 [1]
采集方式
OAI收割 [14]
内容类型
期刊论文 [14]
发表日期
2018 [7]
2017 [4]
2016 [1]
2006 [1]
1991 [1]
学科主题
Materials... [14]
Metallurgy... [7]
Chemistry,... [4]
Physics, A... [3]
Engineerin... [1]
筛选
浏览/检索结果:
共14条,第1-10条
帮助
限定条件
学科主题:Materials Science, Multidisciplinary
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
提交时间升序
提交时间降序
发表日期升序
发表日期降序
题名升序
题名降序
作者升序
作者降序
In-situ chemical interaction in cold-sprayed Zn/Cu composite coating
期刊论文
OAI收割
MATERIALS LETTERS, 2018, 卷号: 228, 页码: 246-249
作者:
Zhao, ZP
;
Tang, JR
;
Du, H
;
Gyansah, L
;
Wang, JQ
  |  
收藏
  |  
浏览/下载:36/0
  |  
提交时间:2018/12/25
Cold spraying
Zn/Cu composite coating
Interfaces
Intermetallic compounds
Amorphization
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
期刊论文
OAI收割
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
作者:
Gao, LY
;
Zhang, H
;
Li, CF
;
Guo, JD
;
Liu, ZQ
  |  
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2018/12/25
Fe-Ni under bump metallization (UBM)
Intermetallic compounds (IMCs)
Electromigration (EM)
Diffusion
Vacancy formation
The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging
期刊论文
OAI收割
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:
Tian, FF
;
Li, CF
;
Zhou, M
;
Liu, ZQ
;
Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
  |  
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2018/06/05
Heterogeneous Binary-systems
Chemical-compound Layers
2 Elementary Substances
Eutectic Snin Solder
Intermetallic Compounds
Phase Identification
Reaction-diffusion
Growth-kinetics
Joint
Transformations
Glass formation adjacent to the intermetallic compounds in Cu-Zr binary system
期刊论文
OAI收割
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 4, 页码: 605-612
作者:
Wang, YX
;
Yao, JH
  |  
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2018/06/05
Bulk Metallic-glass
Amorphous-alloys
Forming Ability
Thermodynamics
Kinetics
Liquid
Transition
Rates
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage
期刊论文
OAI收割
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:
Gao, LY
;
Li, CF
;
Wan, P
;
Zhang, H
;
Liu, ZQ
  |  
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2018/06/05
Lead-free Solders
Interfacial Reactions
Sn-ag
Intermetallic Compounds
Rich Solders
Joints
Growth
Reliability
Substrate
Strength
An effective method to calculate the composition-dependent interdiffusivity with one diffusion couple
期刊论文
OAI收割
COMPUTATIONAL MATERIALS SCIENCE, 2018, 卷号: 143, 页码: 182-188
作者:
Cheng, KM
;
Zhou, JX
;
Xu, HX
;
Tang, SQ
;
Yang, YS
  |  
收藏
  |  
浏览/下载:25/0
  |  
提交时间:2018/06/05
Numerical Inverse Method
Multicomponent Diffusion
High-pressure
Coefficients
Systems
Alloys
Hierarchical micro/nanoscale NdFe11Co oxide and alloy materials synthesized by polyol mediated methods with heat treatment
期刊论文
OAI收割
MATERIALS LETTERS, 2018, 卷号: 212, 页码: 202, 206
作者:
Nguyen Viet Long
;
Yang, Yong
;
Cao Minh Thi
;
Le Hong Phuc
;
Vu Phi Tuyen
  |  
收藏
  |  
浏览/下载:34/0
  |  
提交时间:2018/12/28
Crystal growth
Intermetallic alloys and compounds
NdFe11Co
Nd-Fe-B
Sm-Fe-B
Polyol mediated methods
A New Maraging Stainless Steel with Excellent Strength-Toughness-Corrosion Synergy
期刊论文
OAI收割
MDPI AG, 2017, 卷号: 10, 期号: 11, 页码: -
作者:
Tian, Jialong
;
Wang, Wei
;
Shahzad, M. Babar
  |  
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2018/01/10
Maraging Stainless Steel
Alloy Design
Strength And Toughness
Corrosion Resistance
Atomic Probe Tomography
Precipitation Mechanism
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling
期刊论文
OAI收割
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Gao, Li-Yin
;
Liu, Zhi-Quan
;
Li, Cai-Fu
收藏
  |  
浏览/下载:34/0
  |  
提交时间:2017/08/17
Fe-Ni under bump metallization (UBM)
thermal cycling
microstructural evolution
lifetime
recrystallization
electron backscatter diffraction (EBSD)
Electromigration anisotropy introduced by tin orientation in solder joints
期刊论文
OAI收割
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271
Chen, Jian-Qiang
;
Liu, Kai-Lang
;
Guo, Jing-Dong
;
Ma, Hui-Cai
;
Wei, Song
;
Shang, Jian-Ku
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2017/08/17
Electromigration
Single crystal tin
Cu6Sn5
Intermetallic compounds
Orientation
Diffusion