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• 金属研究所 [18]
• 宁波材料技术与工程研... [6]
• 过程工程研究所 [4]
• 合肥物质科学研究院 [1]

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• OAI收割 [29]

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• 期刊论文 [26]
• 学位论文 [3]

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• 2022 [2]
• 2021 [4]
• 2020 [2]
• 2019 [2]
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• Physics [2]
• Engineerin... [1]
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浏览/检索结果: 共29条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序题名升序题名降序作者升序作者降序发表日期升序发表日期降序 Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer 期刊论文  OAI收割 JOURNAL OF POLYMER RESEARCH, 2022, 卷号: 29 作者:  Zhang, Ping;  Zhang, Xian;  Ding, Xin;  Wang, Yanyan;  Xiao, Chao   |  收藏  |  浏览/下载：30/0  |  提交时间：2022/12/23 Segregated structure  Intermetallic compound  Thermal conductivity  Sliver interface layer   Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11 作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：26/0  |  提交时间：2022/07/01 Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn   Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11 作者:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：28/0  |  提交时间：2022/01/27 Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15 作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：13/0  |  提交时间：2021/03/15 Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 283-290 作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun   |  收藏  |  浏览/下载：11/0  |  提交时间：2021/12/01 TENSILE  JOINTS  SILVER  CU   Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying 期刊论文  OAI收割 MATERIALS TODAY COMMUNICATIONS, 2021, 卷号: 29 作者:  Zhu, Tangkui;  Zhang, Qingke;  Bai, Hailong;  Zhao, Lingyan;  Yan, Jikang   |  收藏  |  浏览/下载：11/0  |  提交时间：2021/12/01 LEAD-FREE SOLDER  NI  BEHAVIOR  CU  SB  AG  MICROSTRUCTURE  (CU  BI  CO   Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 8 作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun   |  收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02 SnBi solder  Ag and In addition  microhardness  nano-indentation  impact toughness  fracture mechanism   Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020 作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun   |  收藏  |  浏览/下载：14/0  |  提交时间：2020/12/16 TENSILE  JOINTS  SILVER  CU   Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614 作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan   |  收藏  |  浏览/下载：134/0  |  提交时间：2021/02/02 alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength   Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 20, 页码: 18524-18538 作者:  Wang, Z.;  Zhang, Q. K.;  Chen, Y. X.;  Song, Z. L.   |  收藏  |  浏览/下载：19/0  |  提交时间：2019/12/18 MECHANICAL-PROPERTIES  INTERFACIAL EMBRITTLEMENT  TENSILE PROPERTIES  SEGREGATION  MICROSTRUCTURE  TEMPERATURE  SUBSTRATE  BISMUTH  BEHAVIOR  GROWTH