机构

• 金属研究所 [11]
• 地理科学与资源研究所 [4]
• 地球环境研究所 [4]
• 过程工程研究所 [2]
• 天津工业生物技术研究... [2]
• 青藏高原研究所 [1]
• 更多

采集方式

• OAI收割 [27]

内容类型

• 期刊论文 [27]

发表日期

• 2025 [3]
• 2024 [2]
• 2023 [3]
• 2022 [5]
• 2020 [3]
• 2019 [2]
• 更多

学科主题

• 地球科学::大气科学 [1]
• 地理学 [1]
• 地质学 [1]

筛选

浏览/检索结果: 共27条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays 期刊论文  OAI收割 APPLIED THERMAL ENGINEERING, 2025, 卷号: 263, 页码: 11 作者:  Wu, Zhitao   |  收藏  |   Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays 期刊论文  OAI收割 APPLIED THERMAL ENGINEERING, 2025, 卷号: 263, 页码: 11 作者:  Wu, Zhitao;  Wang, Wendong;  Bao, Ding;  Wei, Song;  Li, Ruifeng   |  收藏  |   Developing a new ethylene glycol/H2O pretreatment system to achieve efficient enzymatic hydrolysis of sugarcane bagasse cellulose and recover highly active lignin: Countercurrent extraction 期刊论文  OAI收割 SEPARATION AND PURIFICATION TECHNOLOGY, 2025, 卷号: 354, 页码: 12 作者:  You, Zi;  Kang, Xiheng;  Zhao, Siyu;  He, Tieguang;  Zhang, Junhua   |  收藏  |   Improving the thermal, mechanical, and insulating characteristics of thermal interface materials with liquid metal-based diphase structure 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE, 2024, 卷号: 59, 期号: 40, 页码: 19125-19137 作者:  Chen, Siyu;  Li, Ruifeng;  Hu, Hongxiang;  Guo, Jingdong;  Wei, Song   |  收藏  |   Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2024, 卷号: 35, 期号: 16, 页码: 16 作者:  Wang, Wendong;  Wei, Song;  Du, Xinyu;  Zhu, Qingsheng;  Qiao, Yanxin   |  收藏  |   Fabrication of liquid metal/diamond hybrid thermal interface materials with high thermal conductivity and low flowability 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 卷号: 34, 期号: 18, 页码: 16 作者:  Wang, Wendong;  Wei, Song;  Du, Xinyu;  Ding, Zifeng;  Zhu, Qingsheng   |  收藏  |   Effect of Cu/Ga interfacial reaction on heat transfer performance 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 卷号: 34, 期号: 17, 页码: 10 作者:  Du, Xinyu;  Wang, Wendong;  Ding, Zifeng;  Wang, Xiaojing;  Qiao, Yanxin   |  收藏  |   The genomic characteristics and pathogenicity of a mammalian orthoreovirus within a new lineage from wild pika in plateau 期刊论文  OAI收割 VIROLOGICA SINICA, 2023, 卷号: 38, 期号: 6 作者:  Zong, Kexin;  Guo, Yuanyuan;  Song, Jingdong;  Liu, Maoshun;  Hao, Junfeng   |  收藏  |   Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2022, 卷号: 58, 期号: 12, 页码: 1645-1654 作者:  Zhou Lijun;  Wei Song;  Guo Jingdong;  Sun Fangyuan;  Wang Xinwei   |  收藏  |   Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal 期刊论文  OAI收割 COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 卷号: 162, 页码: 7 作者:  Wei, Song;  Wang, Wendong;  Zhou, Lijun;  Guo, Jingdong   |  收藏  |