中国科学院机构知识库网格系统: 检索

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	Toward Developing High-Performance RISC-V Processors Using Agile Methodology 期刊论文 OAI收割 IEEE MICRO, 2023, 卷号: 43, 期号: 4, 页码: 98-106 作者: Xu, Yinan; Yu, Zihao; Tang, Dan; Cai, Ye; Huan, Dandan \| 收藏 \| 浏览/下载：24/0 \| 提交时间：2023/12/04 Program processors Behavioral sciences Chip scale packaging Microarchitecture Hardware Analytical models Layout
	Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文 OAI收割 MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8 作者: Zhu, Qing-Sheng; Ding, Zi-Feng; Wei, Xiang-Fu; Guo, Jing-dong; Wang, Xiao-Jing \| 收藏 \| 浏览/下载：6/0 \| 提交时间：2024/01/07 Copper pillar bump Cu electroplating Leveler Interfacial voids Chip packaging
	A compact killowatt-level QCW high-power semiconductor laser array based on dual-chip integration 会议论文 OAI收割 Virtual, Online, China, 2022-12-05 作者: Zhang, Pu; Ren, Wenzhen; Wang, Bo; Zhu, Xiangping; Yang, Junhong \| 收藏 \| 浏览/下载：19/0 \| 提交时间：2023/03/15 high-power semiconductor laser packaging dual-chip
	A Chip-Level Optical Interconnect for CPU 期刊论文 OAI收割 IEEE PHOTONICS TECHNOLOGY LETTERS, 2021, 卷号: 33, 期号: 16, 页码: 852-855 作者: Hao, Qinfen; Qin, Mengyuan; Qi, Nan; Xue, Haiyun; Han, Meng \| 收藏 \| 浏览/下载：65/0 \| 提交时间：2021/12/01 Integrated optics Optical interconnections Transceivers Adaptive optics Optical switches Optical sensors Power demand Optical interconnections digital integrated circuits very high speed integrated circuits chip scale packaging system integration
	Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文 OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Nie, Zhiqiang; Wu, Di; Lu, Yao; Wu, Dhai; Wang, Shuna 收藏 \| 浏览/下载：94/0 \| 提交时间：2016/11/22 Chip scale packages Defects Degradation Electronics packaging High power lasers Laser beam welding Power semiconductor diodes Reliability Reliability analysis Semiconductor diodes
	A compact QCW conduction-cooled high power semiconductor laser array 会议论文 OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Zhu, Qiwen; Zhang, Pu; Wang, Shuna; Wu, Dihai; Nie, Zhiqiang 收藏 \| 浏览/下载：41/0 \| 提交时间：2016/11/22 Chip scale packages Electronics packaging Finite element method High power lasers High temperature applications Temperature
	Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE) 会议论文 OAI收割 MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China 作者: Wang W.; Wang L.; Wang L.; Wang L.; Chen W. 收藏 \| 浏览/下载：32/0 \| 提交时间：2013/03/25 We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in sixteen V-grooves for optical fibers and micropits for micro ball lenses all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners where different geometries meet. Through this assembling method the fiber micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.