机构

• 金属研究所 [2]
• 计算技术研究所 [2]
• 化学研究所 [2]
• 宁波材料技术与工程研... [1]
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• 半导体研究所 [1]
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采集方式

• OAI收割 [12]

内容类型

• 期刊论文 [12]

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• 2025 [2]
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学科主题

• Engineerin... [1]
• Polymer Sc... [1]
• 半导体化学 [1]

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浏览/检索结果: 共12条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I 期刊论文  OAI收割 IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 2025, 卷号: 15, 期号: 3, 页码: 362-367 作者:  Hao, Qinfen;  Chen, Kuan-Neng;  Goel, Sandeep Kumar;  Li, Hai;  Marinissen, Erik Jan   |  收藏  |   Unveiling the effect of bovine serum albumin on the packaging performance of medical silicone rubber coating for implantable electronic devices 期刊论文  OAI收割 PROGRESS IN ORGANIC COATINGS, 2025, 卷号: 201, 页码: 13 作者:  Qi, Shiqian;  Yan, Hui;  Tang, Ao;  Li, Ying   |  收藏  |   Reliable WBG Devices Packaging by Forming Nano-Gradient Structures on Silver-Plated Substrates 期刊论文  OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 7, 页码: 1156-1163 作者:  Zhang, Bowen;  Zhao, Zhiyuan;  Liu, Yi;  Ma, Haoxiang;  Shi, Chao   |  收藏  |   Design of anti-mildew smart microcapsules with chitosan as encapsulant for advanced electronic packaging epoxy coating 期刊论文  OAI收割 PROGRESS IN ORGANIC COATINGS, 2023, 卷号: 180, 页码: 12 作者:  Li, Bowen;  Ma, Yuantai;  Njoku, Demian;  Meng, Meijiang;  Tang, Ao   |  收藏  |   Chiplet技术发展现状 期刊论文  OAI收割 科技导报, 2023, 卷号: 41, 期号: 19, 页码: 113 作者:  项少林;  郭茂;  蒲菠;  方刘禄;  刘淑娟   |  收藏  |   Characterizations of a Proposed 3300-V Press-Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications 期刊论文  OAI收割 IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 4, 页码: 2245-2253 作者:  Feng, Jingjing;  Mei, Yunhui;  Li, Xianbin;  Lu, Guo-Quan   |  收藏  |   Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure 期刊论文  OAI收割 IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 1, 页码: 175, 187 作者:  Zhang, Hui;  Li, Jianfeng;  Dai, Jingru;  Corfield, Martin;  Liu, Xuejian   |  收藏  |   Eugenol-based Organic Silicone Epoxy Resin and Its Curing Kinetics 期刊论文  OAI收割 JOURNAL OF POLYMER MATERIALS, 2017, 卷号: 34, 期号: 3, 页码: 565-578 作者:  Luo Jun;  Shen Xiaobin;  Sun Liyuan;  Liu Yuan;  Dai Jinyue   |  收藏  |   Microstructures and properties of Al-50%SiC composites for electronic packaging applications 期刊论文  OAI收割 TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2016, 卷号: 26, 期号: 10, 页码: 2647-2652 作者:  Teng Fei;  Yu Kun;  Luo Jie;  Fang Hongjie;  Shi Chunli   |  收藏  |   Synthesis and properties of novel liquid ester-free reworkable cycloaliphatic diepoxides for electronic packaging application 期刊论文  OAI收割 POLYMER, 2003, 卷号: 44, 期号: 4, 页码: 923-929 作者:  Wang, ZG;  Xie, MR;  Zhao, YF;  Yu, YZ;  Fang, SB   |  收藏  |