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• OAI收割 [46]

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• 期刊论文 [46]

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浏览/检索结果: 共46条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Effects of stannum (Sn) addition on corrosion behavior and biocompatibility in vitro of biodegradable Zn-Sn alloys 期刊论文  OAI收割 MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION, 2021 作者:  Guo, Pushan;  Bagheri, Robabeh;  Yang, Lijing;  Song, Zhenlun;  Liu, Yaxuan   |  收藏  |   Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390 作者:  Zhang, Qingke;  Hu, Fangqin;  Song, Zhenlun   |  收藏  |   The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642 作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ   |  收藏  |   Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文  OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355 F. F. Tian; Z. Q. Liu; P. J. Shang; J. D. Guo 收藏  |   Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文  OAI收割 Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933 H. Zhang; Q. S. Zhu; Z. Q. Liu; L. Zhang; H. Y. Guo; C. M. Lai 收藏  |   Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236 M. N. Wang; J. Q. Wang; W. Ke 收藏  |   Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384 Q. K. Zhang; Z. F. Zhang 收藏  |   Corrosion of Ga-doped Sn-0.7Cu Solder in Simulated Marine Atmosphere 期刊论文  OAI收割 Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science, 2013, 卷号: 44A, 期号: 3, 页码: 1462-1474 Z. Yan; A. P. Xian 收藏  |   Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys 期刊论文  OAI收割 Journal of Electronic Materials, 2012, 卷号: 41, 期号: 11, 页码: 3161-3168 H. F. Zhou; J. D. Guo; J. K. Shang 收藏  |   Influences of reflow time and strain rate on interfacial fracture behaviors of Sn-4Ag/Cu solder joints 期刊论文  OAI收割 Journal of Applied Physics, 2012, 卷号: 112, 期号: 6 Q. K. Zhang; Z. F. Zhang 收藏  |