机构

• 上海微系统与信息技术... [4]
• 力学研究所 [1]
• 长春光学精密机械与物... [1]

采集方式

• OAI收割 [6]

内容类型

• 期刊论文 [4]
• 会议论文 [2]

发表日期

• 2012 [1]
• 2008 [1]
• 2007 [1]
• 2004 [2]
• 2001 [1]

学科主题

• Chemistry,... [1]
• Engineerin... [1]
• Engineerin... [1]
• Engineerin... [1]

筛选

浏览/检索结果: 共6条，第1-6条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Research of software re-injection technology for aerospace camera controller in-orbit (EI CONFERENCE) 会议论文  OAI收割 2012 9th IEEE International Conference on Mechatronics and Automation, ICMA 2012, August 5, 2012 - August 8, 2012, Chengdu, China Xu W. 收藏  |   Endurance of lead-free assembly under board level drop test and thermal cycling 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 卷号: 457, 期号: 1-2, 页码: 198-203 Xia, YH; Me, XM 收藏  |   Effect of interfacial reactions on the reliability of lead-free assemblies after board level drop tests 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2007, 卷号: 36, 期号: 9, 页码: 1129-1136 Xia, Y; Lu, C; Xle, X 收藏  |   Research of underfill delamination in flip chip by the J-integral method 期刊论文  OAI收割 JOURNAL OF ELECTRONIC PACKAGING, 2004, 卷号: 126, 期号: 1, 页码: 94-99 Xu, BL; Cai, X; Huang, WD; Cheng, ZN 收藏  |   Lifetime of solder joint and delamination in flip chip assemblies 期刊论文  OAI收割 2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, 页码: 174-186 Cheng, ZN 收藏  |   Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文  OAI收割 Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8 作者:  Liu S;  Zhao YP(赵亚溥);  Zhao YP(赵亚溥);  Liu S;  Liu S 收藏  |