机构

• 上海微系统与信息技术... [4]
• 力学研究所 [1]
• 长春光学精密机械与物... [1]

采集方式

• OAI收割 [6]

内容类型

• 期刊论文 [4]
• 会议论文 [2]

发表日期

• 2012 [1]
• 2008 [1]
• 2007 [1]
• 2004 [2]
• 2001 [1]

学科主题

• Chemistry,... [1]
• Engineerin... [1]
• Engineerin... [1]
• Engineerin... [1]

筛选

浏览/检索结果: 共6条，第1-6条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择作者升序作者降序发表日期升序发表日期降序题名升序题名降序提交时间升序提交时间降序 Research of software re-injection technology for aerospace camera controller in-orbit (EI CONFERENCE) 会议论文  OAI收割 2012 9th IEEE International Conference on Mechatronics and Automation, ICMA 2012, August 5, 2012 - August 8, 2012, Chengdu, China Xu W. 收藏  |  浏览/下载：45/0  |  提交时间：2013/03/25 For the factors of increased of tasks  enhancements of functions and improvement of integrity and complexity in aerospace camera  application system has raised high and long-term in-orbit autonomy and reliability requirements on camera controller. Based on an actual project application background  this paper has put forward a design method of new high reliability aerospace camera controller in-orbit software reinjection instruction sequence which use TSC695F as kernel CPU and process flow of bootstrap receive  cache  checkout and storage update data. Finally  combined with specific test module for camera controller software re-injection  the validity of the software re-injection method raised here has been verified. Still here gives out reference codes of update data package which generated by the ground. 2012 IEEE.   Endurance of lead-free assembly under board level drop test and thermal cycling 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 卷号: 457, 期号: 1-2, 页码: 198-203 Xia, YH; Me, XM 收藏  |  浏览/下载：55/0  |  提交时间：2012/03/24 SCALE PACKAGE INTERCONNECTIONS  INTERFACIAL REACTIONS  FREE SOLDERS  RELIABILITY  IMPACT  SN  NI  JOINTS   Effect of interfacial reactions on the reliability of lead-free assemblies after board level drop tests 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2007, 卷号: 36, 期号: 9, 页码: 1129-1136 Xia, Y; Lu, C; Xle, X 收藏  |  浏览/下载：27/0  |  提交时间：2012/03/24 SOLDER JOINTS  PACKAGE RELIABILITY  COMPOUND FORMATION  TFBGA PACKAGES  IC PACKAGES  IMPACT  CU  INTERCONNECTIONS  METALLIZATION  SIMULATION   Research of underfill delamination in flip chip by the J-integral method 期刊论文  OAI收割 JOURNAL OF ELECTRONIC PACKAGING, 2004, 卷号: 126, 期号: 1, 页码: 94-99 Xu, BL; Cai, X; Huang, WD; Cheng, ZN 收藏  |  浏览/下载：39/0  |  提交时间：2012/03/24 RELIABILITY  INTERFACES  PACKAGE  MODEL   Lifetime of solder joint and delamination in flip chip assemblies 期刊论文  OAI收割 2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, 页码: 174-186 Cheng, ZN 收藏  |  浏览/下载：45/0  |  提交时间：2012/03/24 UNDERFILL MATERIAL PROPERTIES  FATIGUE  RELIABILITY  RELAXATION  STRESS  MODEL  INTERFACES  PACKAGE  GLASS   Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文  OAI收割 Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8 作者:  Liu S;  Zhao YP(赵亚溥);  Zhao YP(赵亚溥);  Liu S 收藏  |  浏览/下载：37/0  |  提交时间：2014/02/14 solder  underfill  filled  0  outmost  substrate  0  fatigue  Package  understand  joints  thermal  lives  0  silicon  reliability  range  0  different  smaller  corners  studied  assumed  simulation