机构

• 金属研究所 [11]

采集方式

• OAI收割 [11]

内容类型

• 期刊论文 [11]

发表日期

• 2019 [1]
• 2015 [1]
• 2013 [1]
• 2011 [1]
• 2010 [2]
• 2009 [1]
• 更多

学科主题

筛选

浏览/检索结果: 共11条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614 作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan   |  收藏  |  浏览/下载：145/0  |  提交时间：2021/02/02 alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength   Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文  OAI收割 Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596 L. M.; Zhang Yang, Z. F. 收藏  |  浏览/下载：27/0  |  提交时间：2015/05/08 Intermetallic compounds (IMC)  solder joint  cooling rate  solidification  adsorption  ag-cu solder  cu6sn5 grains  in-situ  sn  alloy  nanoparticles  ag3sn  microstructure  technology  particles   Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文  OAI收割 Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558 L. M. Yang; Z. F. Zhang 收藏  |  浏览/下载：26/0  |  提交时间：2013/12/24 Lead-free solder  intermetallic compounds  interfacial reaction  grain  growth  sn-ag-cu  shear-strength  mechanical-properties  rare-earth  bga joints  alloy  electromigration  reliability   Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2011, 卷号: 22, 期号: 9, 页码: 1234-1238 C. Chen; L. Zhang; Q. Q. Lai; C. F. Li; J. K. Shang 收藏  |  浏览/下载：22/0  |  提交时间：2012/04/13 thin-films  sn-ag  alloy  cu  systems  fe-42ni  copper  ni  intermetallics  solderability   Fatigue fracture mechanisms of Cu/lead-free solders interfaces 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1367-1376 Q. K. Zhang; Q. S. Zhu; H. F. Zou; Z. F. Zhang 收藏  |  浏览/下载：19/0  |  提交时间：2012/04/13 Lead-free solder  Fatigue fracture  Interface  Strain localization  Vertical cracks  lead-free solders  pb-free solders  deformation-behavior  joints  tensile  cu  embrittlement  temperature  sn-3.5ag  alloy   Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1343-1350 H. Y. Song; Q. S. Zhu; Z. G. Wang; J. K. Shang; M. Lu 收藏  |  浏览/下载：11/0  |  提交时间：2012/04/13 Lead-free solder  Sn-Ag-Cu alloy  Zn addition  Tensile property  Intermetallic compound  sn-ag-cu  free solder alloy  interfacial reactions  deformation  reliability  joints  ag3sn  creep   Enhanced rate-dependent tensile deformation in equal channel angularly pressed Sn-Ag-Cu alloy 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2009, 卷号: 502, 期号: 1-2, 页码: 153-158 Q. S. Zhu; Z. G. Wang; S. D. Wu; J. K. Shang 收藏  |  浏览/下载：22/0  |  提交时间：2012/04/13 Sn-Ag-Cu alloy  Strain rate sensitivity  Time-dependent deformation  Grain boundary diffusion  strain-rate sensitivity  lead-free solders  superplastic deformation  temperature  joints  flow  microstructure  property  stresses   Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文  OAI收割 Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129 H. F. Zou; Z. F. Zhang 收藏  |  浏览/下载：28/0  |  提交时间：2012/04/13 Sn-Ag-Zn  lead-free solder  gravity  interfaces  intermetallic compounds  lead-free solders  cu substrate  bump metallization  tensile properties  phase-equilibria  eutectic alloy  ni  behavior  bi  microstructure   Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2007, 卷号: 43, 期号: 1, 页码: 41-46 作者:  Zhu Qingsheng;  Zhang Li;  Wang Zhongguang;  Wu Shiding;  Shang Jianku   |  收藏  |  浏览/下载：17/0  |  提交时间：2021/02/02 Pb-free solder  Sn3.8Ag0.7Cu alloy  intermetallics  equal channel angular pressing  mechanical property   Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2007, 卷号: 43, 期号: 1, 页码: 41-46 作者:  Zhu Qingsheng;  Zhang Li;  Wang Zhongguang;  Wu Shiding;  Shang Jianku   |  收藏  |  浏览/下载：14/0  |  提交时间：2021/02/02 Pb-free solder  Sn3.8Ag0.7Cu alloy  intermetallics  equal channel angular pressing  mechanical property