中国科学院机构知识库网格系统: 检索

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	Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文 OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11 作者: Chen, Yinbo; Gao, Zhaoqing; Liu, Zhi-Quan \| 收藏 \| 浏览/下载：40/0 \| 提交时间：2022/07/01 Sn-Bi-Ag solder Grain orientation Temperature gradient Aging Ag3Sn
	Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface 期刊论文 OAI收割 Journal of Electronic Materials, 2011, 卷号: 40, 期号: 11, 页码: 2320-2328 Q. K. Zhang; H. F. Zou; Z. F. Zhang 收藏 \| 浏览/下载：23/0 \| 提交时间：2012/04/13 Sn-Bi solder Bi segregation interfacial embrittlement substrate alloying reflow temperature tensile strength lead-free solders joints microstructure embrittlement interconnect bismuth ag
	In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints 期刊论文 OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 6, 页码: 2686-2693 Q. K. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：12/0 \| 提交时间：2012/04/13 In situ observation Shear Creep-fatigue Fracture Sn-58Bi solder Grain-boundary sliding lead-free solders sn-bi microstructure evolution tensile properties alloys deformation technology metals ag
	Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文 OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745 作者: Kang T Y; Xiu Y Y; Hui L; Wang J J; Tong W P \| 收藏 \| 浏览/下载：15/0 \| 提交时间：2021/02/26 SN-AG CU SUBSTRATE INTERFACIAL REACTIONS MICROSTRUCTURE COPPER BI TEMPERATURE STRENGTH ALLOYS JOINTS Solder Interfacial reaction Intermetallics Kinetics
	Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate 期刊论文 OAI收割 Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 207-214 H. F. Zou; Z. F. Zhang 收藏 \| 浏览/下载：17/0 \| 提交时间：2012/04/13 Ag single crystal substrate Lead-free solder Intermetallic compounds (IMCs) Growth kinetics Local cracks lead-free solders electroless ni(p) metallization intermetallic compound cu-sn joints ni bi nanoindentation microstructure wt.percent
	Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文 OAI收割 Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129 H. F. Zou; Z. F. Zhang 收藏 \| 浏览/下载：28/0 \| 提交时间：2012/04/13 Sn-Ag-Zn lead-free solder gravity interfaces intermetallic compounds lead-free solders cu substrate bump metallization tensile properties phase-equilibria eutectic alloy ni behavior bi microstructure
	Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure 期刊论文 OAI收割 Journal of Electronic Materials, 2005, 卷号: 34, 期号: 1, 页码: 62-67 Q. L. Zeng; Z. G. Wang; A. P. Xian; J. K. Shang 收藏 \| 浏览/下载：32/0 \| 提交时间：2012/04/14 lead-free solder low-cycle fatigue cyclic softening Sn-3.8Ag-0.7Cu alloy sn-ag-cu fatigue behavior bi