机构

• 金属研究所 [16]
• 过程工程研究所 [2]
• 上海微系统与信息技术... [2]

采集方式

• OAI收割 [20]

内容类型

• 期刊论文 [20]

发表日期

• 2025 [1]
• 2024 [3]
• 2019 [2]
• 2016 [1]
• 2013 [1]
• 2012 [1]
• 更多

学科主题

• Chemistry,... [1]
• Engineerin... [1]

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浏览/检索结果: 共20条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Study on stress relaxation behavior and mechanism of typical high strength and elasticity copper alloy 期刊论文  OAI收割 MATERIALS TODAY COMMUNICATIONS, 2025, 卷号: 44, 页码: 11 作者:  Zhang, Mengxiao;  Song, Hongwu;  Guo, Wei;  Cheng, Ming;  Xu, Yong   |  收藏  |   Improving the stability of microstructure and mechanical property in Cu-9Ni-6Sn-0.2Nb alloy by annealing treatment 期刊论文  OAI收割 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2024, 卷号: 916, 页码: 11 作者:  Xu, Siyang;  Wei, Jiaqi;  Han, Yahui;  Cao, Dongdong;  Jiang, Yifu   |  收藏  |   Improving the stability of microstructure and mechanical property in Cu-9Ni-6Sn-0.2Nb alloy by annealing treatment 期刊论文  OAI收割 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2024, 卷号: 916, 页码: 11 作者:  Xu, Siyang;  Wei, Jiaqi;  Han, Yahui;  Cao, Dongdong;  Jiang, Yifu   |  收藏  |   Improving the stability of microstructure and mechanical property in Cu-9Ni-6Sn-0.2Nb alloy by annealing treatment 期刊论文  OAI收割 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2024, 卷号: 916, 页码: 11 作者:  Xu, Siyang;  Wei, Jiaqi;  Han, Yahui;  Cao, Dongdong;  Jiang, Yifu   |  收藏  |   Preparation and solidification process of mono-sized Cu-Ni-Sn microspheres by pulsated orifice ejection method 期刊论文  OAI收割 MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 5, 页码: 8 作者:  Li, Can;  Li, Jianqiang;  Hu, Yingyan;  Liu, Chao;  Li, Xiaoyu   |  收藏  |   Preparation and solidification process of mono-sized Cu–Ni–Sn microspheres by pulsated orifice ejection method 期刊论文  OAI收割 Materials Research Express, 2019, 卷号: 6, 期号: 5 作者:  Li,Can;  Li,Jianqiang;  Hu,Yingyan;  Liu,Chao;  Li,Xiaoyu   |  收藏  |   Sn-Cu-Ni系电子封装互连材料的研究进展 期刊论文  OAI收割 电子元件与材料, 2016, 期号: 12, 页码: 1-6 杨帆; 张亮; 刘志权; 钟素娟; 马佳; 鲍丽 收藏  |   Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint 期刊论文  OAI收割 Journal of Materials Science & Technology, 2013, 卷号: 29, 期号: 1, 页码: 7-12 H. F. Zhou; J. D. Guo; Q. S. Zhu; J. K. Shang 收藏  |   Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints 期刊论文  OAI收割 Journal of Electronic Materials, 2012, 卷号: 41, 期号: 9, 页码: 2487-2494 C. Chen; L. Zhang; J. X. Zhao; L. H. Cao; J. K. Shang 收藏  |   Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2011, 卷号: 22, 期号: 9, 页码: 1234-1238 C. Chen; L. Zhang; Q. Q. Lai; C. F. Li; J. K. Shang 收藏  |