机构

• 半导体研究所 [14]
• 西安光学精密机械研... [10]
• 长春光学精密机械与物... [5]
• 西北高原生物研究所 [5]
• 金属研究所 [4]
• 化学研究所 [4]
• 更多

采集方式

• OAI收割 [77]
• iSwitch采集 [8]

内容类型

• 期刊论文 [63]
• 会议论文 [21]
• 学位论文 [1]

发表日期

• 2024 [3]
• 2023 [5]
• 2022 [2]
• 2021 [6]
• 2020 [3]
• 2019 [5]
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学科主题

• 光电子学 [7]
• semiconduc... [3]
• computer a... [2]
• lasers, ge... [2]
• light/opti... [2]
• numerical ... [2]
• 更多

筛选

浏览/检索结果: 共85条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Fabrication and characterizations of biodegradable films based on polysaccharide from Pyropia yezoensis waste with antioxidant and antibacterial activities 期刊论文  OAI收割 JOURNAL OF APPLIED PHYCOLOGY, 2024, 页码: 14 作者:  Qiang, Xi;  Song, Yuling;  Niu, Jianfeng;  Gu, Wenhui;  Wang, Xulei   |  收藏  |  浏览/下载：6/0  |  提交时间：2024/12/20 Pyropia yezoensis  Bangiophyceae  Polysaccharides  Edible films  Biodegradable  Food packaging   Reliable WBG Devices Packaging by Forming Nano-Gradient Structures on Silver-Plated Substrates 期刊论文  OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 7, 页码: 1156-1163 作者:  Zhang, Bowen;  Zhao, Zhiyuan;  Liu, Yi;  Ma, Haoxiang;  Shi, Chao   |  收藏  |  浏览/下载：12/0  |  提交时间：2024/10/21 Substrates  Annealing  Silver  Nanoscale devices  Sputtering  Nanostructures  Bonding  Nano-gradient structure  power electronic packaging  reliability  silver paste  strength-ductility dilemma   Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics 期刊论文  OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 1, 页码: 10-17 作者:  Zhang, Bowen;  Lu, Xinyan;  Ma, Haoxiang;  Wang, Di;  Mei, Yun-Hui   |  收藏  |  浏览/下载：13/0  |  提交时间：2024/05/07 Silver  Sintering  Force  Substrates  Copper  Bonding  Thermal stability  Reliability packaging  silver paste  sintering driving force   COORDINATION OF SUPPLY CHAIN CONSIDERING CONSUMERS? GREEN PREFERENCE UNDER REDUCED PACKAGING STRATEGY 期刊论文  OAI收割 JOURNAL OF INDUSTRIAL AND MANAGEMENT OPTIMIZATION, 2023, 卷号: 19, 期号: 8, 页码: 6264-6285 作者:  Zhao, Chao;  Song JX(宋吉祥)   |  收藏  |  浏览/下载：10/0  |  提交时间：2023/04/20 Supply chain  green preferences  reduced packaging  coordination of supply chain   Toward Developing High-Performance RISC-V Processors Using Agile Methodology 期刊论文  OAI收割 IEEE MICRO, 2023, 卷号: 43, 期号: 4, 页码: 98-106 作者:  Xu, Yinan;  Yu, Zihao;  Tang, Dan;  Cai, Ye;  Huan, Dandan   |  收藏  |  浏览/下载：24/0  |  提交时间：2023/12/04 Program processors  Behavioral sciences  Chip scale packaging  Microarchitecture  Hardware  Analytical models  Layout   Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8 作者:  Zhu, Qing-Sheng;  Ding, Zi-Feng;  Wei, Xiang-Fu;  Guo, Jing-dong;  Wang, Xiao-Jing   |  收藏  |  浏览/下载：3/0  |  提交时间：2024/01/07 Copper pillar bump  Cu electroplating  Leveler  Interfacial voids  Chip packaging   Design of anti-mildew smart microcapsules with chitosan as encapsulant for advanced electronic packaging epoxy coating 期刊论文  OAI收割 PROGRESS IN ORGANIC COATINGS, 2023, 卷号: 180, 页码: 12 作者:  Li, Bowen;  Ma, Yuantai;  Njoku, Demian;  Meng, Meijiang;  Tang, Ao   |  收藏  |  浏览/下载：10/0  |  提交时间：2024/01/07 Smart microcapsule  Halloysite clay nanotubes  Chitosan  Dual -pH sensitive  Electronic packaging coating  Anti -mildew   Chiplet技术发展现状 期刊论文  OAI收割 科技导报, 2023, 卷号: 41, 期号: 19, 页码: 113 作者:  项少林;  郭茂;  蒲菠;  方刘禄;  刘淑娟   |  收藏  |  浏览/下载：32/0  |  提交时间：2024/05/20 chiplet technology  chiplet interconnect interfaces  advanced packaging  multi physical field electronic assisted design  signal and power integrity  chiplet技术  芯粒互连接口  先进封装  多物理场电子辅助设计  信号与电源完整性   When one cannot bypass the byproducts: Plastic packaging waste embedded in production and export 期刊论文  OAI收割 JOURNAL OF INDUSTRIAL ECOLOGY, 2022, 页码: 15 作者:  Gao, Xiang;  Dall'erba, Sandy;  Ellison, Brenna;  Avelino, Andre F. T.;  Yang, Cuihong   |  收藏  |  浏览/下载：19/0  |  提交时间：2023/02/07 environment responsibility  environmental footprint  global value chain  industrial ecology  input-output analysis  plastic packaging waste   A compact killowatt-level QCW high-power semiconductor laser array based on dual-chip integration 会议论文  OAI收割 Virtual, Online, China, 2022-12-05 作者:  Zhang, Pu;  Ren, Wenzhen;  Wang, Bo;  Zhu, Xiangping;  Yang, Junhong   |  收藏  |  浏览/下载：17/0  |  提交时间：2023/03/15 high-power semiconductor laser  packaging  dual-chip