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• 半导体研究所 [14]
• 西安光学精密机械研... [10]
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学科主题

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浏览/检索结果: 共88条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I 期刊论文  OAI收割 IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 2025, 卷号: 15, 期号: 3, 页码: 362-367 作者:  Hao, Qinfen;  Chen, Kuan-Neng;  Goel, Sandeep Kumar   |  收藏  |   Unveiling the effect of bovine serum albumin on the packaging performance of medical silicone rubber coating for implantable electronic devices 期刊论文  OAI收割 PROGRESS IN ORGANIC COATINGS, 2025, 卷号: 201, 页码: 13 作者:  Qi, Shiqian;  Yan, Hui;  Tang, Ao;  Li, Ying   |  收藏  |   Photothermal functionalized antibacterial packaging film with controllable release capability for fruit preservation 期刊论文  OAI收割 FOOD RESEARCH INTERNATIONAL, 2025, 卷号: 206 作者:  Luo, Linpin;  Su, Wenqiao;  Hassan, Mohamed F.;  Cai, Wengang;  Wang, Meilin   |  收藏  |   Fabrication and characterizations of biodegradable films based on polysaccharide from Pyropia yezoensis waste with antioxidant and antibacterial activities 期刊论文  OAI收割 JOURNAL OF APPLIED PHYCOLOGY, 2024, 页码: 14 作者:  Qiang, Xi;  Song, Yuling;  Niu, Jianfeng;  Gu, Wenhui;  Wang, Xulei   |  收藏  |   Reliable WBG Devices Packaging by Forming Nano-Gradient Structures on Silver-Plated Substrates 期刊论文  OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 7, 页码: 1156-1163 作者:  Zhang, Bowen;  Zhao, Zhiyuan;  Liu, Yi;  Ma, Haoxiang;  Shi, Chao   |  收藏  |   Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics 期刊论文  OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 1, 页码: 10-17 作者:  Zhang, Bowen;  Lu, Xinyan;  Ma, Haoxiang;  Wang, Di;  Mei, Yun-Hui   |  收藏  |   COORDINATION OF SUPPLY CHAIN CONSIDERING CONSUMERS? GREEN PREFERENCE UNDER REDUCED PACKAGING STRATEGY 期刊论文  OAI收割 JOURNAL OF INDUSTRIAL AND MANAGEMENT OPTIMIZATION, 2023, 卷号: 19, 期号: 8, 页码: 6264-6285 作者:  Zhao, Chao;  Song JX(宋吉祥)   |  收藏  |   Toward Developing High-Performance RISC-V Processors Using Agile Methodology 期刊论文  OAI收割 IEEE MICRO, 2023, 卷号: 43, 期号: 4, 页码: 98-106 作者:  Xu, Yinan;  Yu, Zihao;  Tang, Dan;  Cai, Ye;  Huan, Dandan   |  收藏  |   Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8 作者:  Zhu, Qing-Sheng;  Ding, Zi-Feng;  Wei, Xiang-Fu;  Guo, Jing-dong;  Wang, Xiao-Jing   |  收藏  |   Design of anti-mildew smart microcapsules with chitosan as encapsulant for advanced electronic packaging epoxy coating 期刊论文  OAI收割 PROGRESS IN ORGANIC COATINGS, 2023, 卷号: 180, 页码: 12 作者:  Li, Bowen;  Ma, Yuantai;  Njoku, Demian;  Meng, Meijiang;  Tang, Ao   |  收藏  |