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Chinese Academy of Sciences Institutional Repositories Grid
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CAS IR Grid
机构
金属研究所 [10]
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OAI收割 [10]
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期刊论文 [10]
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2025 [1]
2020 [1]
2018 [1]
2009 [3]
2008 [2]
2006 [2]
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Materials ... [1]
Metallurgy... [1]
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Improving mechanical properties of dissimilar TA3/L907A steel clad plates with multiple interlayers via hot-compression bonding
期刊论文
OAI收割
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2025, 卷号: 36, 页码: 111-122
作者:
Xiao, He
;
Liu, Weifeng
;
Dai, Qianning
;
Ren, Shaofei
;
Xu, Bin
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The effect of finish layer on the interfacial cracking failure of Au-Si bonding
期刊论文
OAI收割
ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8
作者:
Gao, Li-Yin
;
Wen, Jian
;
Li, Cai-Fu
;
Chen, Chunhuan
;
Liu, Zhi-Quan
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Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
期刊论文
OAI收割
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
作者:
Gao, LY
;
Zhang, H
;
Li, CF
;
Guo, JD
;
Liu, ZQ
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Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate
期刊论文
OAI收割
Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 207-214
H. F. Zou
;
Z. F. Zhang
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Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints
期刊论文
OAI收割
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 6, 页码: 852-859
Q. K. Zhang
;
H. F. Zou
;
Z. F. Zhang
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  |  
Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times
期刊论文
OAI收割
Journal of Alloys and Compounds, 2009, 卷号: 485, 期号: 1-2, 页码: 853-861
Q. K. Zhang
;
Z. F. Zhang
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Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint
期刊论文
OAI收割
Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417
H. F. Zou
;
Q. S. Zhu
;
Z. F. Zhang
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Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals
期刊论文
OAI收割
Acta Materialia, 2008, 卷号: 56, 期号: 11, 页码: 2649-2662
H. F. Zou
;
H. J. Yang
;
Z. F. Zhang
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Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07.
期刊论文
OAI收割
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 卷号: 435, 页码: 588-594
作者:
Zhu, Q. S.
;
Zhang, Z. F.
;
Shang, J. K.
;
Wang, Z. G.
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Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07
期刊论文
OAI收割
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2006, 卷号: 435, 页码: 588-594
Q. S. Zhu
;
Z. F. Zhang
;
J. K. Shang
;
Z. Wang
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