机构

• 金属研究所 [41]
• 上海微系统与信息技术... [3]
• 宁波材料技术与工程研... [2]

采集方式

• OAI收割 [46]

内容类型

• 期刊论文 [46]

发表日期

• 2021 [1]
• 2020 [1]
• 2018 [1]
• 2014 [3]
• 2013 [2]
• 2012 [3]
• 更多

学科主题

• Engineerin... [2]
• Chemistry,... [1]
• Chemistry,... [1]
• Engineerin... [1]
• Materials ... [1]
• Materials ... [1]
• 更多

筛选

浏览/检索结果: 共46条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Effects of stannum (Sn) addition on corrosion behavior and biocompatibility in vitro of biodegradable Zn-Sn alloys 期刊论文  OAI收割 MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION, 2021 作者:  Guo, Pushan;  Bagheri, Robabeh;  Yang, Lijing;  Song, Zhenlun;  Liu, Yaxuan   |  收藏  |  浏览/下载：29/0  |  提交时间：2021/12/01 LEAD-FREE SOLDERS  CARDIOVASCULAR STENTS  MECHANICAL-PROPERTIES  ZINC  MG  COMPOSITES  DESIGN   Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390 作者:  Zhang, Qingke;  Hu, Fangqin;  Song, Zhenlun   |  收藏  |  浏览/下载：60/0  |  提交时间：2020/12/16 LEAD-FREE SOLDERS  INTERMETALLIC COMPOUNDS  LIQUID SN  KINETICS  GROWTH  CU6SN5  METALLIZATION   The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642 作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ   |  收藏  |  浏览/下载：37/0  |  提交时间：2018/06/05 Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength   Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文  OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355 F. F. Tian; Z. Q. Liu; P. J. Shang; J. D. Guo 收藏  |  浏览/下载：29/0  |  提交时间：2014/04/18 Phase identification  Interface  IMC  Eutectic SnIn solder  Single  crystalline Cu  gamma-angular correlations  lead-free solders  joint reliability  growth-kinetics  system  equilibria  mechanisms  interfaces  diffusion  layer   Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文  OAI收割 Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933 H. Zhang; Q. S. Zhu; Z. Q. Liu; L. Zhang; H. Y. Guo; C. M. Lai 收藏  |  浏览/下载：34/0  |  提交时间：2015/01/14 Fe-Ni alloy  Under bump metallization (UBM)  Intermetallic compound  (IMC)  Reliability  High temperature storage  Temperature cycling  lead-free solders  intermetallic compounds  growth-kinetics  cu  metallization  ag  strength  ball  ubm   Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236 M. N. Wang; J. Q. Wang; W. Ke 收藏  |  浏览/下载：24/0  |  提交时间：2014/04/18 lead-free solders  3.5-percent nacl solution  electrochemical corrosion  ga solder  reliability  surface  alloys  joints  tin  sn   Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384 Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：21/0  |  提交时间：2013/12/24 Sn-Ag/Cu solder joints  Thermal fatigue  Strain localization  Grain  rotation  Dynamic recovery  stress-relaxation behavior  eutectic sn-3.5ag solder  lead-free solders  pb-free solders  sn-ag  tensile properties  shear-strength  fracture-behavior  deformation  creep   Corrosion of Ga-doped Sn-0.7Cu Solder in Simulated Marine Atmosphere 期刊论文  OAI收割 Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science, 2013, 卷号: 44A, 期号: 3, 页码: 1462-1474 Z. Yan; A. P. Xian 收藏  |  浏览/下载：26/0  |  提交时间：2013/12/24 lead-free solders  electrochemical corrosion  whisker growth  nacl  solution  thin-films  tin  oxidation  behavior  alloys   Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys 期刊论文  OAI收割 Journal of Electronic Materials, 2012, 卷号: 41, 期号: 11, 页码: 3161-3168 H. F. Zhou; J. D. Guo; J. K. Shang 收藏  |  浏览/下载：20/0  |  提交时间：2013/02/05 Electroless Fe-Ni  under-bump metallization  interfacial reaction  lead-free solders  wetting balance  snagcu solder  cu  joints  solderability  growth  ag   Influences of reflow time and strain rate on interfacial fracture behaviors of Sn-4Ag/Cu solder joints 期刊论文  OAI收割 Journal of Applied Physics, 2012, 卷号: 112, 期号: 6 Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：23/0  |  提交时间：2013/02/05 lead-free solders  to-brittle transition  intermetallic compounds  deformation-behavior  tensile properties  shear-strength  sn  sn-3.5ag  tin  cu