机构

• 金属研究所 [10]

采集方式

• OAI收割 [10]

内容类型

• 期刊论文 [10]

发表日期

• 2013 [3]
• 2011 [2]
• 2010 [2]
• 2009 [1]
• 2007 [1]
• 2006 [1]
• 更多

学科主题

筛选

浏览/检索结果: 共10条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384 Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：21/0  |  提交时间：2013/12/24 Sn-Ag/Cu solder joints  Thermal fatigue  Strain localization  Grain  rotation  Dynamic recovery  stress-relaxation behavior  eutectic sn-3.5ag solder  lead-free solders  pb-free solders  sn-ag  tensile properties  shear-strength  fracture-behavior  deformation  creep   Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文  OAI收割 Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558 L. M. Yang; Z. F. Zhang 收藏  |  浏览/下载：26/0  |  提交时间：2013/12/24 Lead-free solder  intermetallic compounds  interfacial reaction  grain  growth  sn-ag-cu  shear-strength  mechanical-properties  rare-earth  bga joints  alloy  electromigration  reliability   Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2013, 卷号: 24, 期号: 1, 页码: 211-216 H. Y. Liu; Q. S. Zhu; Z. G. Wang; J. D. Guo; J. K. Shang 收藏  |  浏览/下载：18/0  |  提交时间：2013/12/24 intermetallic compound formation  sn-3.8ag-0.7cu solder  cu  microstructure  joints   In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文  OAI收割 Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028 Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：35/0  |  提交时间：2012/04/13 SnAg/Cu solder joints  Creep fatigue  In situ observation  Strain  localization  Grain subdivision  lead-free solders  pb-sn solder  tensile properties  shear-strength  deformation-behavior  sn-3.5ag solder  strain-rate  ag  microstructure  alloys   Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745 作者:  Kang T Y;  Xiu Y Y;  Hui L;  Wang J J;  Tong W P   |  收藏  |  浏览/下载：13/0  |  提交时间：2021/02/26 SN-AG  CU SUBSTRATE  INTERFACIAL REACTIONS  MICROSTRUCTURE  COPPER  BI  TEMPERATURE  STRENGTH  ALLOYS  JOINTS  Solder  Interfacial reaction  Intermetallics  Kinetics   Fatigue fracture mechanisms of Cu/lead-free solders interfaces 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1367-1376 Q. K. Zhang; Q. S. Zhu; H. F. Zou; Z. F. Zhang 收藏  |  浏览/下载：19/0  |  提交时间：2012/04/13 Lead-free solder  Fatigue fracture  Interface  Strain localization  Vertical cracks  lead-free solders  pb-free solders  deformation-behavior  joints  tensile  cu  embrittlement  temperature  sn-3.5ag  alloy   Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1343-1350 H. Y. Song; Q. S. Zhu; Z. G. Wang; J. K. Shang; M. Lu 收藏  |  浏览/下载：11/0  |  提交时间：2012/04/13 Lead-free solder  Sn-Ag-Cu alloy  Zn addition  Tensile property  Intermetallic compound  sn-ag-cu  free solder alloy  interfacial reactions  deformation  reliability  joints  ag3sn  creep   Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate 期刊论文  OAI收割 Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 207-214 H. F. Zou; Z. F. Zhang 收藏  |  浏览/下载：17/0  |  提交时间：2012/04/13 Ag single crystal substrate  Lead-free solder  Intermetallic compounds  (IMCs)  Growth kinetics  Local cracks  lead-free solders  electroless ni(p) metallization  intermetallic  compound  cu-sn  joints  ni  bi  nanoindentation  microstructure  wt.percent   Mechanical fatigue of Sn-rich Pb-free solder alloys 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2007, 卷号: 18, 期号: 1-3, 页码: 211-227 J. K. Shang; Q. L. Zeng; L. Zhang; Q. S. Zhu 收藏  |  浏览/下载：20/0  |  提交时间：2012/04/13 low-cycle fatigue  lead-free solders  crack-growth-behavior  thermal  fatigue  63sn-37pb solder  eutectic solder  thermomechanical fatigue  ag-cu  joints  life   Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2006, 卷号: 435, 页码: 588-594 Q. S. Zhu; Z. F. Zhang; J. K. Shang; Z. Wang 收藏  |  浏览/下载：40/0  |  提交时间：2012/04/14 Sn-Ag-Cu solder  copper single crystal  intermetallic compounds (IMCs)  interface  cyclic deformation  persistent slip bands (PSBs)  fatigue  cracking  persistent slip bands  pb-free solders  intermetallic compounds  cyclic  deformation  joints  behavior  growth  microstructure  evolution  strength