中国科学院机构知识库网格系统: 检索

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	The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文 OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509 作者: Tian, FF; Li, CF; Zhou, M; Liu, ZQ; Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China. \| 收藏 \| 浏览/下载：24/0 \| 提交时间：2018/06/05 Heterogeneous Binary-systems Chemical-compound Layers 2 Elementary Substances Eutectic Snin Solder Intermetallic Compounds Phase Identification Reaction-diffusion Growth-kinetics Joint Transformations
	Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文 OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355 F. F. Tian; Z. Q. Liu; P. J. Shang; J. D. Guo 收藏 \| 浏览/下载：29/0 \| 提交时间：2014/04/18 Phase identification Interface IMC Eutectic SnIn solder Single crystalline Cu gamma-angular correlations lead-free solders joint reliability growth-kinetics system equilibria mechanisms interfaces diffusion layer
	Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文 OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384 Q. K. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：21/0 \| 提交时间：2013/12/24 Sn-Ag/Cu solder joints Thermal fatigue Strain localization Grain rotation Dynamic recovery stress-relaxation behavior eutectic sn-3.5ag solder lead-free solders pb-free solders sn-ag tensile properties shear-strength fracture-behavior deformation creep
	Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern 期刊论文 OAI收割 Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 12, 页码: 1143-1147 W. Liu; L. Zhang; K. J. Hsia; J. K. Shang 收藏 \| 浏览/下载：21/0 \| 提交时间：2012/04/13 Wetting Reactive wetting Spreading Solder Thin film pattern Liquid film morphological wetting transitions structured surfaces eutectic snpb films
	Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect 期刊论文 OAI收割 Journal of Electronic Materials, 2009, 卷号: 38, 期号: 3, 页码: 425-429 X. F. Zhang; J. D. Guo; J. K. Shang 收藏 \| 浏览/下载：16/0 \| 提交时间：2012/04/13 Electromigration coupling effect polarity intermetallic compound interfacial reaction zn based solders ni-p/au layer cross-interaction intermetallic compounds bump metallization eutectic snpb sn-9zn solder cu joints combination
	Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文 OAI收割 Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129 H. F. Zou; Z. F. Zhang 收藏 \| 浏览/下载：28/0 \| 提交时间：2012/04/13 Sn-Ag-Zn lead-free solder gravity interfaces intermetallic compounds lead-free solders cu substrate bump metallization tensile properties phase-equilibria eutectic alloy ni behavior bi microstructure
	Mechanical fatigue of Sn-rich Pb-free solder alloys 期刊论文 OAI收割 Journal of Materials Science-Materials in Electronics, 2007, 卷号: 18, 期号: 1-3, 页码: 211-227 J. K. Shang; Q. L. Zeng; L. Zhang; Q. S. Zhu 收藏 \| 浏览/下载：22/0 \| 提交时间：2012/04/13 low-cycle fatigue lead-free solders crack-growth-behavior thermal fatigue 63sn-37pb solder eutectic solder thermomechanical fatigue ag-cu joints life
	Bi segregation at interface of the eutectic SnBi/Cu solder joint 期刊论文 OAI收割 ACTA METALLURGICA SINICA, 2005, 卷号: 41, 期号: 8, 页码: 847-852 作者: Liu, CZ; Zhang, W; Sui, ML; Shang, JK \| 收藏 \| 浏览/下载：12/0 \| 提交时间：2021/02/02 eutectic SnBi/Cu solder joint segregation interfacial reaction Pb-free solder
	Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect 期刊论文 OAI收割 Journal of Electronic Materials, 2005, 卷号: 34, 期号: 11, 页码: 1363-1367 Q. L. Yang; J. K. Shang 收藏 \| 浏览/下载：19/0 \| 提交时间：2012/04/14 electromigration solder interconnect interface eutectic snpb electromigration