机构

• 金属研究所 [9]

采集方式

• OAI收割 [9]

内容类型

• 期刊论文 [9]

发表日期

• 2018 [1]
• 2014 [1]
• 2013 [1]
• 2010 [1]
• 2009 [1]
• 2008 [1]
• 更多

学科主题

• Chemistry,... [1]
• Materials ... [1]
• Metallurgy... [1]

筛选

浏览/检索结果: 共9条，第1-9条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509 作者:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.   |  收藏  |   Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文  OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355 F. F. Tian; Z. Q. Liu; P. J. Shang; J. D. Guo 收藏  |   Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384 Q. K. Zhang; Z. F. Zhang 收藏  |   Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern 期刊论文  OAI收割 Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 12, 页码: 1143-1147 W. Liu; L. Zhang; K. J. Hsia; J. K. Shang 收藏  |   Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect 期刊论文  OAI收割 Journal of Electronic Materials, 2009, 卷号: 38, 期号: 3, 页码: 425-429 X. F. Zhang; J. D. Guo; J. K. Shang 收藏  |   Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文  OAI收割 Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129 H. F. Zou; Z. F. Zhang 收藏  |   Mechanical fatigue of Sn-rich Pb-free solder alloys 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2007, 卷号: 18, 期号: 1-3, 页码: 211-227 J. K. Shang; Q. L. Zeng; L. Zhang; Q. S. Zhu 收藏  |   Bi segregation at interface of the eutectic SnBi/Cu solder joint 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2005, 卷号: 41, 期号: 8, 页码: 847-852 作者:  Liu, CZ;  Zhang, W;  Sui, ML;  Shang, JK   |  收藏  |   Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect 期刊论文  OAI收割 Journal of Electronic Materials, 2005, 卷号: 34, 期号: 11, 页码: 1363-1367 Q. L. Yang; J. K. Shang 收藏  |