中国科学院机构知识库网格系统: 检索

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	Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation 期刊论文 OAI收割 INTERMETALLICS, 2015, 卷号: 58, 页码: 84—90 作者: Wang, TM; Zhou, P; Cao, F; Kang, HJ; Chen, ZN 收藏 \| 浏览/下载：22/0 \| 提交时间：2015/12/09 LEAD-FREE SOLDER INTERFACIAL REACTIONS IMAGING TECHNOLOGY CURRENT-DENSITY ZN ADDITION MICROSTRUCTURE ALLOYS NI SOLIDIFICATION IMPROVEMENT
	Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文 OAI收割 Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236 M. N. Wang; J. Q. Wang; W. Ke 收藏 \| 浏览/下载：25/0 \| 提交时间：2014/04/18 lead-free solders 3.5-percent nacl solution electrochemical corrosion ga solder reliability surface alloys joints tin sn
	In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM 期刊论文 OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 558, 页码: 649-655 M. N. Wang; J. Q. Wang; H. Feng; W. Ke 收藏 \| 浏览/下载：40/0 \| 提交时间：2013/02/05 Lead-free solder Microstructure Corrosion Three-point bending Fracture electrochemical corrosion behavior 3.5-percent nacl solution ga solder alloys sn joints
	In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文 OAI收割 Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028 Q. K. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：35/0 \| 提交时间：2012/04/13 SnAg/Cu solder joints Creep fatigue In situ observation Strain localization Grain subdivision lead-free solders pb-sn solder tensile properties shear-strength deformation-behavior sn-3.5ag solder strain-rate ag microstructure alloys
	In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints 期刊论文 OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 6, 页码: 2686-2693 Q. K. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：12/0 \| 提交时间：2012/04/13 In situ observation Shear Creep-fatigue Fracture Sn-58Bi solder Grain-boundary sliding lead-free solders sn-bi microstructure evolution tensile properties alloys deformation technology metals ag
	Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文 OAI收割 Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66 P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang 收藏 \| 浏览/下载：17/0 \| 提交时间：2012/04/13 in situ TEM straining single crystal Sn slip system self-diffusion crack propagation free solder alloys lead-free solders thermal fatigue behavior creep tin pb joints ag deformation
	Tin whisker growth on bulk Sn-Pb eutectic doping with Nd 期刊论文 OAI收割 Microelectronics Reliability, 2009, 卷号: 49, 期号: 6, 页码: 667-672 M. Liu; A. P. Xian 收藏 \| 浏览/下载：15/0 \| 提交时间：2012/04/13 free solder alloys surface cu joints
	Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder 期刊论文 OAI收割 Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 6, 页码: 811-816 J. J. Guo; L. Zhang; A. P. Xian; J. K. Shang 收藏 \| 浏览/下载：22/0 \| 提交时间：2012/04/13 solderability FeNi alloys lead-free solders wetting electroless-nickel/solder interface enig plating layer thermal-stability sn-0.4cu solder cu substrate plated kovar sn reflow copper part
	Coupling effects at Cu(Ni)-SnAgCu-Cu(Ni) sandwich solder joint during isothermal aging 期刊论文 OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2006, 卷号: 417, 期号: 1-2, 页码: 143-149 Xia, YH; Xie, XM; Lu, CY; Chang, JL 收藏 \| 浏览/下载：19/0 \| 提交时间：2012/03/24 WT-PERCENT CU LEAD-FREE SOLDERS INTERFACIAL REACTIONS SN-3.5-PERCENT-AG SOLDER BUMP METALLIZATION SN NI ALLOYS REFLOW MICROSTRUCTURE