机构

• 金属研究所 [11]
• 合肥物质科学研究院 [1]

采集方式

• OAI收割 [12]

内容类型

• 期刊论文 [12]

发表日期

• 2024 [1]
• 2020 [1]
• 2018 [1]
• 2014 [3]
• 2013 [1]
• 2011 [1]
• 更多

学科主题

• Chemistry,... [1]
• Materials ... [1]
• Metallurgy... [1]

筛选

浏览/检索结果: 共12条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Study of faceted Al2Cu intermetallic compounds growth during solidification under strong static magnetic field via X-ray computed tomography 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2024, 卷号: 1006 作者:  Lin, Wenhao;  Feng, Meilong;  Qin, Zhonghan;  Li, Hao;  Liu, Chunmei   |  收藏  |  浏览/下载：10/0  |  提交时间：2024/11/20 Strong static magnetic field  Intermetallic compound  Crystal growth and coarsening  X-ray computed tomography   Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process 期刊论文  OAI收割 METALS AND MATERIALS INTERNATIONAL, 2020, 卷号: 26, 期号: 3, 页码: 333-345 作者:  Hua, Fu-an;  Song, Hong-wu;  Sun, Tao;  Li, Jian-ping   |  收藏  |  浏览/下载：21/0  |  提交时间：2021/02/02 Bimetal  Cold roll bonding  Intermetallic compound  Growth kinetics  Inter-diffusion   The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509 作者:  Tian, FF   |  收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05 Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations   Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 5, 页码: 2297-2304 X. J. Wang; Q. S. Zhu; B. Liu; N. Liu; F. J. Wang 收藏  |  浏览/下载：29/0  |  提交时间：2014/07/03 lead-free solder  intermetallic compound growth  corrosion behavior  mechanical-properties  cu substrate  alloy  microstructure  reduction  aluminum  vacuum   Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint 期刊论文  OAI收割 Materials Letters, 2014, 卷号: 121, 页码: 185-187 F. F. Tian; P. J. Shang; Z. Q. Liu 收藏  |  浏览/下载：19/0  |  提交时间：2014/07/03 Interfaces  Intermetallic alloys and compounds  Diffusion  Kirkendall  void  SnIn solder  cu substrate  growth-kinetics  snagcu solder  diffusion  compound  identification  ni   Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文  OAI收割 Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933 H. Zhang; Q. S. Zhu; Z. Q. Liu; L. Zhang; H. Y. Guo; C. M. Lai 收藏  |  浏览/下载：34/0  |  提交时间：2015/01/14 Fe-Ni alloy  Under bump metallization (UBM)  Intermetallic compound  (IMC)  Reliability  High temperature storage  Temperature cycling  lead-free solders  intermetallic compounds  growth-kinetics  cu  metallization  ag  strength  ball  ubm   Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints 期刊论文  OAI收割 Journal of Applied Physics, 2013, 卷号: 114, 期号: 15 J. Q. Chen; J. D. Guo; K. L. Liu; J. K. Shang 收藏  |  浏览/下载：24/0  |  提交时间：2013/12/24 intermetallic compound formation  diffusion  tin  interconnect  growth  metals  gold   Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect 期刊论文  OAI收割 Journal of Alloys and Compounds, 2011, 卷号: 509, 期号: 5, 页码: 1785-1789 T. Y. Kang; Y. Y. Xiu; C. Z. Liu; L. Hui; J. J. Wang; W. P. Tong 收藏  |  浏览/下载：23/0  |  提交时间：2012/04/13 Bi segregation  Interconnect  Kinetics  Intermetallic compound growth  lead-free solders  cu   Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate 期刊论文  OAI收割 Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 207-214 H. F. Zou; Z. F. Zhang 收藏  |  浏览/下载：17/0  |  提交时间：2012/04/13 Ag single crystal substrate  Lead-free solder  Intermetallic compounds  (IMCs)  Growth kinetics  Local cracks  lead-free solders  electroless ni(p) metallization  intermetallic  compound  cu-sn  joints  ni  bi  nanoindentation  microstructure  wt.percent   Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints 期刊论文  OAI收割 Journal of Electronic Materials, 2009, 卷号: 38, 期号: 6, 页码: 852-859 Q. K. Zhang; H. F. Zou; Z. F. Zhang 收藏  |  浏览/下载：45/0  |  提交时间：2012/04/13 Lead-free solders  interface  intermetallic compounds (IMCs)  fatigue  crack  fractography  intermetallic compound  deformation-behavior  cu  microstructure  evolution  growth  96.5sn-3.5ag  temperature  interfaces  morphology