中国科学院机构知识库网格系统: 检索

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	Reliability and joint reliability importance in a consecutive-k-within-m-out-of-n:f system with markov-dependent components 期刊论文 iSwitch采集 Ieee transactions on reliability, 2016, 卷号: 65, 期号: 2, 页码: 802-815 作者: Zhu, Xiaoyan; Boushaba, Mahmoud; Reghioua, Mohamed 收藏 \|
	Joint reliability importance in a consecutive-k-out-of-n:f system and an m-consecutive-k-out-of-n:f system for markov-dependent components 期刊论文 iSwitch采集 Ieee transactions on reliability, 2015, 卷号: 64, 期号: 2, 页码: 784-798 作者: Zhu, Xiaoyan; Boushaba, Mahmoud; Reghioua, Mohamed 收藏 \|
	Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文 OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355 F. F. Tian; Z. Q. Liu; P. J. Shang; J. D. Guo 收藏 \|
	Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate 期刊论文 OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667 F. F. Tian; Z. Q. Liu 收藏 \|
	Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints 期刊论文 OAI收割 Scripta Materialia, 2012, 卷号: 67, 期号: 7-8, 页码: 637-640 L. M. Yang; Q. K. Zhang; Z. F. Zhang 收藏 \|
	Warpage and Reliability of a 3D-MCM on an Embedded Substrate With Multiple Interconnection Method 期刊论文 OAI收割 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2010, 卷号: 33, 期号: 3, 页码: 571-581 Xu, GW; Geng, F; Huang, QP; Luo, L; Zhou, JA 收藏 \|
	Dome design and coupled thermal-mechanical analysis of supersonic missile (EI CONFERENCE) 会议论文 OAI收割 2009 International Conference on Optical Instruments and Technology, OIT 2009, October 19, 2009 - October 22, 2009, Shanghai, China Xing-qiao A.; Qun W.; Hong-guang J. 收藏 \|
	Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling 期刊论文 OAI收割 Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 1, 页码: 85-91 W. Wang; Z. G. Wang; A. P. Xian; J. K. Shang 收藏 \|