中国科学院机构知识库网格系统: 检索

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	Reliability and joint reliability importance in a consecutive-k-within-m-out-of-n:f system with markov-dependent components 期刊论文 iSwitch采集 Ieee transactions on reliability, 2016, 卷号: 65, 期号: 2, 页码: 802-815 作者: Zhu, Xiaoyan; Boushaba, Mahmoud; Reghioua, Mohamed 收藏 \| 浏览/下载：32/0 \| 提交时间：2019/05/09 Consecutive-k-within-m-out-of-n:f system Joint reliability importance Markov-dependent components Probability generating function
	Joint reliability importance in a consecutive-k-out-of-n:f system and an m-consecutive-k-out-of-n:f system for markov-dependent components 期刊论文 iSwitch采集 Ieee transactions on reliability, 2015, 卷号: 64, 期号: 2, 页码: 784-798 作者: Zhu, Xiaoyan; Boushaba, Mahmoud; Reghioua, Mohamed 收藏 \| 浏览/下载：40/0 \| 提交时间：2019/05/10 M-consecutive-k-out-of-n : f system Consecutive-k-out-of-n : f system Joint reliability importance Markov-dependent components Probability generating function
	Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文 OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355 F. F. Tian; Z. Q. Liu; P. J. Shang; J. D. Guo 收藏 \| 浏览/下载：29/0 \| 提交时间：2014/04/18 Phase identification Interface IMC Eutectic SnIn solder Single crystalline Cu gamma-angular correlations lead-free solders joint reliability growth-kinetics system equilibria mechanisms interfaces diffusion layer
	Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate 期刊论文 OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667 F. F. Tian; Z. Q. Liu 收藏 \| 浏览/下载：38/0 \| 提交时间：2014/03/14 48Sn52In IMC Morphology Orientation relationship EBSD interfacial reactions soldering reaction joint reliability void formation solid-state sn cu3sn alloy creep
	Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints 期刊论文 OAI收割 Scripta Materialia, 2012, 卷号: 67, 期号: 7-8, 页码: 637-640 L. M. Yang; Q. K. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：23/0 \| 提交时间：2013/02/05 Solder joint Interfaces Intermetallic compounds Fracture Shear strength lead-free solder brazed joints size sn microstructure deformation reliability failure copper cu
	Warpage and Reliability of a 3D-MCM on an Embedded Substrate With Multiple Interconnection Method 期刊论文 OAI收割 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2010, 卷号: 33, 期号: 3, 页码: 571-581 Xu, GW; Geng, F; Huang, QP; Luo, L; Zhou, JA 收藏 \| 浏览/下载：17/0 \| 提交时间：2011/12/17 SOLDER JOINT RELIABILITY ASSEMBLIES
	Dome design and coupled thermal-mechanical analysis of supersonic missile (EI CONFERENCE) 会议论文 OAI收割 2009 International Conference on Optical Instruments and Technology, OIT 2009, October 19, 2009 - October 22, 2009, Shanghai, China Xing-qiao A.; Qun W.; Hong-guang J. 收藏 \| 浏览/下载：60/0 \| 提交时间：2013/03/25 A review of high-speed flow pressure and aerodynamic heating effect on Supersonic missile's dome is given. The dome should have excellent properties in optical mechanical and chemical characteristics. A design of dome on supersonic mode is described according to tactical guide line of a missile. The dome made of quartz which is about 8mm thick and 141mm in window diameter. To check up the reliability of the dome a reasonable finite element model (FEM) of dome is established and a thermal-mechanical Analysis to the dome by finite element software NASTRAN has carried on through these can obtained the distribution of temperature field and stress field when the speed is 2.3Ma. The results indicated that the stress was concentrated in the joint of the dome end and the Missile Section and the maximum stress was 16.4Mpa. The stress of other nodes was smaller than the allowable stress of quartz glass. Reference to the results of the analysis a lightweight revision to the dome structural dimension and a new method of dome fixing have put forward which can reduce the stress concentration. 2009 SPIE.
	Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling 期刊论文 OAI收割 Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 1, 页码: 85-91 W. Wang; Z. G. Wang; A. P. Xian; J. K. Shang 收藏 \| 浏览/下载：20/0 \| 提交时间：2012/04/13 CBGA thermal cycling FEM assembly cracking solder joint reliability level reliability flex-substrate interconnect snagcu bga segregation packages behavior bismuth