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• 过程工程研究所 [1]
• 合肥物质科学研究院 [1]

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• OAI收割 [46]

内容类型

• 期刊论文 [46]

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• 2022 [1]
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浏览/检索结果: 共46条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序作者升序作者降序 Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11 作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：44/0  |  提交时间：2022/07/01 Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn   Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying 期刊论文  OAI收割 MATERIALS TODAY COMMUNICATIONS, 2021, 卷号: 29 作者:  Zhu, Tangkui;  Zhang, Qingke;  Bai, Hailong;  Zhao, Lingyan;  Yan, Jikang   |  收藏  |  浏览/下载：26/0  |  提交时间：2021/12/01 LEAD-FREE SOLDER  NI  BEHAVIOR  CU  SB  AG  MICROSTRUCTURE  (CU  BI  CO   Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 8 作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun   |  收藏  |  浏览/下载：150/0  |  提交时间：2021/02/02 SnBi solder  Ag and In addition  microhardness  nano-indentation  impact toughness  fracture mechanism   银铜钛膏状钎料钎焊石墨和铜合金接头的微观组织及性能 期刊论文  OAI收割 核聚变与等离子体物理, 2020, 卷号: 40 作者:  刘严伟;  曹磊;  许铁军;  韩乐;  訾鹏飞   |  收藏  |  浏览/下载：84/0  |  提交时间：2020/11/25 Ag-Cu-Ti paste solder  Vacuum brazing  Graphite  Copper alloy  Shear strength  银铜钛(Ag-Cu-Ti)膏状钎料  真空钎焊  石墨  铜合金  剪切强度   Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614 作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan   |  收藏  |  浏览/下载：148/0  |  提交时间：2021/02/02 alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua   |  收藏  |  浏览/下载：28/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua   |  收藏  |  浏览/下载：21/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint 期刊论文  OAI收割 Journal of Applied Physics, 2015, 卷号: 117, 期号: 1 L. M.; Zhang Yang, Z. F. 收藏  |  浏览/下载：20/0  |  提交时间：2015/05/08 ag-cu solder  growth  behaviors  packages  lead   Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文  OAI收割 Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596 L. M.; Zhang Yang, Z. F. 收藏  |  浏览/下载：31/0  |  提交时间：2015/05/08 Intermetallic compounds (IMC)  solder joint  cooling rate  solidification  adsorption  ag-cu solder  cu6sn5 grains  in-situ  sn  alloy  nanoparticles  ag3sn  microstructure  technology  particles   Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384 Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：24/0  |  提交时间：2013/12/24 Sn-Ag/Cu solder joints  Thermal fatigue  Strain localization  Grain  rotation  Dynamic recovery  stress-relaxation behavior  eutectic sn-3.5ag solder  lead-free solders  pb-free solders  sn-ag  tensile properties  shear-strength  fracture-behavior  deformation  creep