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	The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文 OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642 作者: Gao, LY; Li, CF; Wan, P; Zhang, H; Liu, ZQ \| 收藏 \| 浏览/下载：40/0 \| 提交时间：2018/06/05 Lead-free Solders Interfacial Reactions Sn-ag Intermetallic Compounds Rich Solders Joints Growth Reliability Substrate Strength
	The facile synthesis, crystallization behavior and magnetic property of FeNiP amorphous nanoparticles 期刊论文 OAI收割 MATERIALS CHARACTERIZATION, 2018, 卷号: 136, 页码: 94-99 作者: Yuan, J; Li, CF; Yang, B; Liu, ZQ; Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China. \| 收藏 \| 浏览/下载：29/0 \| 提交时间：2018/06/05 High Saturation Magnetization Interfacial Reliability Alloys Temperature Fabrication Relaxation
	Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate 期刊论文 OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 10, 页码: 1885-1890 作者: Sun FuLong; Gao LiYin; Liu ZhiQuan; Zhang Hao; Sugahara Tohru \| 收藏 \| 浏览/下载：22/0 \| 提交时间：2021/02/02 NI SOLDER JOINTS NANO-SCALE TWINS INTERFACIAL RELIABILITY FE-NI COPPER METALS DEFORMATION STRENGTH DEPENDENCE BOUNDARIES Electrodeposition Nanotwinned Cu Growth mechanism Acid adsorption
	Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate 期刊论文 OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667 F. F. Tian; Z. Q. Liu 收藏 \| 浏览/下载：37/0 \| 提交时间：2014/03/14 48Sn52In IMC Morphology Orientation relationship EBSD interfacial reactions soldering reaction joint reliability void formation solid-state sn cu3sn alloy creep
	Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文 OAI收割 Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558 L. M. Yang; Z. F. Zhang 收藏 \| 浏览/下载：26/0 \| 提交时间：2013/12/24 Lead-free solder intermetallic compounds interfacial reaction grain growth sn-ag-cu shear-strength mechanical-properties rare-earth bga joints alloy electromigration reliability
	Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy 期刊论文 OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1343-1350 H. Y. Song; Q. S. Zhu; Z. G. Wang; J. K. Shang; M. Lu 收藏 \| 浏览/下载：11/0 \| 提交时间：2012/04/13 Lead-free solder Sn-Ag-Cu alloy Zn addition Tensile property Intermetallic compound sn-ag-cu free solder alloy interfacial reactions deformation reliability joints ag3sn creep
	Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition 期刊论文 OAI收割 Journal of Alloys and Compounds, 2009, 卷号: 479, 期号: 1-2, 页码: 505-510 X. F. Zhang; J. D. Guo; J. K. Shang 收藏 \| 浏览/下载：24/0 \| 提交时间：2012/04/13 Intermetallic compound Electroless Ni-P Interfacial reaction Zn addition Tin lead-free solders interfacial reactions cu substrate metallization joints reliability growth microstructure packages alloys
	Endurance of lead-free assembly under board level drop test and thermal cycling 期刊论文 OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 卷号: 457, 期号: 1-2, 页码: 198-203 Xia, YH; Me, XM 收藏 \| 浏览/下载：28/0 \| 提交时间：2012/03/24 SCALE PACKAGE INTERCONNECTIONS INTERFACIAL REACTIONS FREE SOLDERS RELIABILITY IMPACT SN NI JOINTS
	On the formation of Cu-Ni-Sn ternary intermetallics in SNIT solder joints 期刊论文 OAI收割 PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), 2004, 页码: 66-69 Chang, JL; Xia, YH; Xie, XM 收藏 \| 浏览/下载：22/0 \| 提交时间：2012/03/24 INTERFACIAL REACTIONS RELIABILITY