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• 金属研究所 [7]
• 上海微系统与信息技术... [2]

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• OAI收割 [9]

内容类型

• 期刊论文 [9]

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• 2018 [3]
• 2014 [1]
• 2013 [1]
• 2010 [1]
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• 2008 [1]
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学科主题

• Materials ... [2]
• Metallurgy... [2]
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浏览/检索结果: 共9条，第1-9条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642 作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ   |  收藏  |   The facile synthesis, crystallization behavior and magnetic property of FeNiP amorphous nanoparticles 期刊论文  OAI收割 MATERIALS CHARACTERIZATION, 2018, 卷号: 136, 页码: 94-99 作者:  Yuan, J;  Li, CF;  Yang, B;  Liu, ZQ;  Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.   |  收藏  |   Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 10, 页码: 1885-1890 作者:  Sun FuLong;  Gao LiYin;  Liu ZhiQuan;  Zhang Hao;  Sugahara Tohru   |  收藏  |   Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate 期刊论文  OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667 F. F. Tian; Z. Q. Liu 收藏  |   Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文  OAI收割 Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558 L. M. Yang; Z. F. Zhang 收藏  |   Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1343-1350 H. Y. Song; Q. S. Zhu; Z. G. Wang; J. K. Shang; M. Lu 收藏  |   Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition 期刊论文  OAI收割 Journal of Alloys and Compounds, 2009, 卷号: 479, 期号: 1-2, 页码: 505-510 X. F. Zhang; J. D. Guo; J. K. Shang 收藏  |   Endurance of lead-free assembly under board level drop test and thermal cycling 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 卷号: 457, 期号: 1-2, 页码: 198-203 Xia, YH; Me, XM 收藏  |   On the formation of Cu-Ni-Sn ternary intermetallics in SNIT solder joints 期刊论文  OAI收割 PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), 2004, 页码: 66-69 Chang, JL; Xia, YH; Xie, XM 收藏  |