机构

• 金属研究所 [6]

采集方式

• OAI收割 [6]

内容类型

• 期刊论文 [6]

发表日期

• 2019 [2]
• 2014 [1]
• 2013 [1]
• 2011 [1]
• 2009 [1]

学科主题

筛选

浏览/检索结果: 共6条，第1-6条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua   |  收藏  |  浏览/下载：25/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua   |  收藏  |  浏览/下载：20/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文  OAI收割 Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933 H. Zhang; Q. S. Zhu; Z. Q. Liu; L. Zhang; H. Y. Guo; C. M. Lai 收藏  |  浏览/下载：34/0  |  提交时间：2015/01/14 Fe-Ni alloy  Under bump metallization (UBM)  Intermetallic compound  (IMC)  Reliability  High temperature storage  Temperature cycling  lead-free solders  intermetallic compounds  growth-kinetics  cu  metallization  ag  strength  ball  ubm   Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging 期刊论文  OAI收割 Microscopy and Microanalysis, 2013, 卷号: 19, 页码: 105-108 Z. Q. Liu; P. J. Shang; F. F. Tan; D. X. Li 收藏  |  浏览/下载：22/0  |  提交时间：2014/04/18 lead-free solder  Kirkendall void  intermetallic compound (IMC)  diffusion  interface  transmission electron microscopy (TEM)  cu   Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples 期刊论文  OAI收割 Journal of Electronic Materials, 2011, 卷号: 40, 期号: 7, 页码: 1542-1548 H. F. Zou; Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：17/0  |  提交时间：2012/04/13 Cu(3)Sn  void  Cu alloys  intermetallic compound (IMC)  interfacial  reaction  free solders  mechanisms  diffusion  strength  joints   TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface 期刊论文  OAI收割 Journal of Electronic Materials, 2009, 卷号: 38, 期号: 12, 页码: 2579-2584 P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang 收藏  |  浏览/下载：25/0  |  提交时间：2012/04/13 Intermetallic compound (IMC)  SnBi solder  interface  diffusion  growth  mechanism  reactive interface  solder joints  molten sn  cu-sn  technology  kinetics