中国科学院机构知识库网格系统: 检索

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	Optimization of Tunnel-Junction for Perovskite/Tunnel Oxide Passivated Contact (TOPCon) Tandem Solar Cells 期刊论文 OAI收割 PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2021 作者: Shou, Chunhui; Zheng, Jingming; Han, Qingling; Zeng, Yuheng; Ding, Waner \| 收藏 \| 浏览/下载：39/0 \| 提交时间：2021/12/01 DETAILED BALANCE LIMIT THIN-FILM SI EFFICIENCY VOLTAGE WAFER
	Micro-electro-mechanical systems capacitive ultrasonic transducer with a higher electromechanical coupling coefficient 期刊论文 OAI收割 Micro & Nano Letters, 2015, 卷号: 10, 期号: 10, 页码: 4 作者: Miao, J(苗静); Shen, WJ(沈文江); He, CD; Xue, CY; Xiong, JJ 收藏 \| 浏览/下载：92/0 \| 提交时间：2015/12/31 silicon elemental semiconductors silicon-on-insulator wafer bonding electromechanical effects ultrasonic transducers capacitive transducers micromechanical devices micromachining vibrations membranes finite element analysis reliability capacitance electromechanical coupling coefficient capacitive micromachined ultrasonic transducer impedance matching propagation medium microelectromechanical system capacitive ultrasonic transducer silicon on insulator wafer bonding optimum geometric dimensions membrane mechanical vibration electrical characteristics finite-element analysis operation mode device safety device reliability equivalent stress operation-collapse voltage bottom electrodes glass substrate surface parallel parasitic capacitance Si SiO2
	Growth and Electrical Properties of Zinc Oxide Nanowires 期刊论文 OAI收割 JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2009, 卷号: 9, 期号: 2, 页码: 1119 Zhang, ZX; Zhao, YC; Sun, LF; Liu, DF; Shen, J; Zhou, WY; Luo, Q; Jin, A; Yang, HF; Gu, CZ; Xie, SS 收藏 \| 浏览/下载：30/0 \| 提交时间：2013/09/17 ZNO NANONEEDLE ARRAYS FIELD-EMISSION SI WAFER PHOTOLUMINESCENCE NANOBELTS NANOTUBES LASER
	Development of an experimental EUVL system (EI CONFERENCE) 会议论文 OAI收割 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies, AOMATT 2007: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, July 8, 2007 - July 12, 2007, Chengdu, China 作者: Wang L.-P.; Zhang L.-C.; Jin C.-S. 收藏 \| 浏览/下载：24/0 \| 提交时间：2013/03/25 An experimental EUVL system has been developed to investigate EUV imaging system design component fabrication assembly technique and experimental process. The system includes a laser produced plasma (LPP) source an ellipsoidal condenser a transmission mask a reduced projection optics and vacuum system. We designed a 10:1 reduction projection optics using Schwarzschild system with spherical mirrors to achieve 0.1m resolution. The Schwarzschild optics coated with Mo/Si multilayers was assembled with wavefront error (WFE) of 0.014 waves RMS at 632.8nm wavelength under computer-aided alignment method. Using this system a fine pattern of less than 0.25m covering a 0.1mm diameter image field of view was clearly replicated on resist-coated wafer.
	Strain analysis of inp/ingaasp wafer bonded on si by x-ray double crystalline diffraction 期刊论文 iSwitch采集 Materials science and engineering b-solid state materials for advanced technology, 2006, 卷号: 133, 期号: 1-3, 页码: 117-123 作者: Zhao, Hong-Quan; Yu, Li-Juan; Huang, Yong-Zhen; Wang, Yu-Tian 收藏 \| 浏览/下载：32/0 \| 提交时间：2019/05/12 Inp Si X-ray double crystalline diffraction Thermal strain Wafer bonding
	Strain analysis of InP/InGaAsP wafer bonded on Si by X-ray double crystalline diffraction 期刊论文 OAI收割 materials science and engineering b-solid state materials for advanced technology, 2006, 卷号: 133, 期号: 1-3, 页码: 117-123 Zhao HQ (Zhao Hong-Quan); Yu LJ (Yu Li-Juan); Huang YZ (Huang Yong-Zhen); Wang YT (Wang Yu-Tian) 收藏 \| 浏览/下载：46/0 \| 提交时间：2010/04/11 InP Si X-ray double crystalline diffraction thermal strain wafer bonding OPTOELECTRONIC DEVICES EPITAXIAL OVERGROWTHS TEMPERATURE INTERFACE STRESSES VCSELS SURFACES ENERGY
	Wafer bonding technique used for the integration of cubic GaN/GaAs (001) with Si substrate 期刊论文 OAI收割 SCIENCE IN CHINA SERIES E-TECHNOLOGICAL SCIENCES, 2002, 卷号: 45, 期号: 3, 页码: #REF! 作者: Sun, YP; Fu, Y; Qu, B; Wang, YT; Feng, ZH 收藏 \| 浏览/下载：21/0 \| 提交时间：2016/04/12 wafer bonding cubic GaN/GaAs(001) Si-substrate
	Wafer bonding technique used for the integration of cubic GaN/GaAs (001) with Si substrate 期刊论文 OAI收割 science in china series e-technological sciences, 2002, 卷号: 45, 期号: 3, 页码: 255-260 作者: Zhang SM; Zhao DG 收藏 \| 浏览/下载：104/5 \| 提交时间：2010/08/12 wafer bonding cubic GaN/GaAs(001) Si-substrate LIGHT-EMITTING-DIODES P-TYPE GAN RESISTANCE CONTACT LASER