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• 上海微系统与信息技术... [9]
• 半导体研究所 [3]
• 长春光学精密机械与物... [2]
• 大连化学物理研究所 [2]
• 中国科学院大学 [2]
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• OAI收割 [20]
• iSwitch采集 [3]

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• 期刊论文 [20]
• 会议论文 [3]

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• 2021 [1]
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筛选

浏览/检索结果: 共23条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Impact of TID on Within-Wafer Variability of Radiation-Hardened SOI Wafers 期刊论文  OAI收割 IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2021, 卷号: 68, 期号: 7, 页码: 1423-1429 作者:  Zheng, QW (Zheng, Qiwen) 1;  Cui, JW (Cui, Jiangwei) 1;  Yu, XF (Yu, Xuefeng) 1;  Li, YD (Li, Yudong) 1;  Lu, W (Lu, Wu) 1   |  收藏  |  浏览/下载：41/0  |  提交时间：2021/08/06 Radiation-hardened (RH)silicon-on-insulator (SOI)total ionizing dose (TID)within-wafer variability   Research on ultra-smooth collimation separation of silicon wafer by multiple lasers 会议论文  OAI收割 Suzhou, China, 2020-05-01 作者:  Youwang, Hu;  Ming, Li;  Qinqin, Xie;  Xiaoyan, Sun   |  收藏  |  浏览/下载：14/0  |  提交时间：2020/07/28 silicon wafer  laser  thermal cracking  prefabricated crack   Phosphorous diffusion gettering of n-type cz silicon wafers for improving the performances of silicon heterojunction solar cells 期刊论文  iSwitch采集 Solar energy materials and solar cells, 2016, 卷号: 157, 页码: 74-78 作者:  Zhu, Fangzhou;  Wang, Dongliang;  Bian, Jiantao;  Liu, Jinning;  Liu, Zhengxin 收藏  |  浏览/下载：41/0  |  提交时间：2019/05/09 Phosphorus diffusion gettering  N-type silicon wafer  Minority carrier lifetime  Heterojunction solar cell   Micro-electro-mechanical systems capacitive ultrasonic transducer with a higher electromechanical coupling coefficient 期刊论文  OAI收割 Micro & Nano Letters, 2015, 卷号: 10, 期号: 10, 页码: 4 作者:  Miao, J(苗静);  Shen, WJ(沈文江);  He, CD;  Xue, CY;  Xiong, JJ 收藏  |  浏览/下载：84/0  |  提交时间：2015/12/31 silicon  elemental semiconductors  silicon-on-insulator  wafer bonding  electromechanical effects  ultrasonic transducers  capacitive transducers  micromechanical devices  micromachining  vibrations  membranes  finite element analysis  reliability  capacitance  electromechanical coupling coefficient  capacitive micromachined ultrasonic transducer  impedance matching  propagation medium  microelectromechanical system capacitive ultrasonic transducer  silicon on insulator  wafer bonding  optimum geometric dimensions  membrane mechanical vibration  electrical characteristics  finite-element analysis  operation mode  device safety  device reliability  equivalent stress  operation-collapse voltage  bottom electrodes  glass substrate surface  parallel parasitic capacitance  Si  SiO2   Robust Prototypical Anti-icing Coatings with a Self-lubricating Liquid Water Layer between Ice and Substrate 期刊论文  OAI收割 ACS APPLIED MATERIALS & INTERFACES, 2013, 卷号: 5, 期号: 10, 页码: 4026-4030 作者:  Chen, Jing;  Dou, Renmei;  Cui, Dapeng;  Zhang, Qiaolan;  Zhang, Yifan   |  收藏  |  浏览/下载：24/0  |  提交时间：2019/04/09 Anti-icing Surface  Hygroscopic Polymer  Ice Adhesion  Micropore Arrayed Silicon Wafer  Self-lubricating Liquid Water Layer   Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding 期刊论文  OAI收割 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 期号: 6, 页码: 1484-1491 Wu, GQ; Xu, DH; Xiong, B; Wang, YC; Wang, YL; Ma, YL 收藏  |  浏览/下载：107/0  |  提交时间：2013/04/23 Bulk mode  glass frit bonding  microelectromechanical systems (MEMS)  redistribution  resonators  silicon bumps  vacuum package  wafer-level package   Redistribution of Electrical Interconnections for Three-Dimensional Wafer-Level Packaging With Silicon Bumps 期刊论文  OAI收割 IEEE ELECTRON DEVICE LETTERS, 2012, 卷号: 33, 期号: 8, 页码: 1177-1179 Wu, GQ; Xu, DH; Xiong, B; Wang, YL 收藏  |  浏览/下载：18/0  |  提交时间：2013/04/23 Redistribution of electrical interconnection  silicon bumps  wafer-level packaging  3-D packaging   Wavelength-tunable si-based ingaas resonant cavity enhanced photodetectors using sol-gel wafer bonding technology 期刊论文  iSwitch采集 Ieee photonics technology letters, 2011, 卷号: 23, 期号: 13, 页码: 881-883 作者:  Zhang, Lingzi;  Cao, Quan;  Zuo, Yuhua;  Xue, Chunlai;  Cheng, Buwen 收藏  |  浏览/下载：29/0  |  提交时间：2019/05/12 Resonant cavity enhanced (rce) photodetector  Silicon photonics  Sol-gel wafer bonding  Thermal tuning   Preparation and biocompatibility of BSA monolayer on slicon surface 期刊论文  OAI收割 Journal of Nanoscience and Nanotechnology, 2011, 卷号: 11, 期号: 6, 页码: 5068-5074 作者:  Yang SR(杨生荣);  Zhang JY(张俊彦) 收藏  |  浏览/下载：22/0  |  提交时间：2012/09/24 Dopamine  Bovine Serum Albumin  Monolayer  Silicon Wafer   Information extraction from laser speckle patterns using wavelet entropy techniques (EI CONFERENCE) 会议论文  OAI收割 MIPPR 2011: Multispectral Image Acquisition, Processing, and Analysis, November 4, 2011 - November 6, 2011, Guilin, China 作者:  Li X.-Z.;  Wang X.-J. 收藏  |  浏览/下载：37/0  |  提交时间：2013/03/25 A novel speckle patterns processing method is presented using multi-scale wavelet techniques. Laser speckle patterns generated from the sample contained abundant information. In this paper  we propose a method using wavelet entropy techniques to analyze the speckle patterns and exact the information on the sample surface. In our case  we used this approach to test the solar silicon cell surface profiles based on the sym8 orthogonal wavelet family. According different wavelet entropy values  the micro-structure of different solar silicon cell surfaces were comparative analyzed. Furthermore  we studied the AFM and reflective spectra of the wafer. Results show that the wavelet entropy speckle processing method is effective and accurate. And the experiment proved that this method is a useful tool to investigate the surface profile quality. 2011 SPIE.