机构

• 金属研究所 [11]

采集方式

• OAI收割 [11]

内容类型

• 期刊论文 [11]

发表日期

• 2022 [1]
• 2017 [1]
• 2012 [1]
• 2011 [3]
• 2009 [1]
• 2008 [1]
• 更多

学科主题

• Materials ... [1]

筛选

浏览/检索结果: 共11条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11 作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：39/0  |  提交时间：2022/07/01 Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn   Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder 期刊论文  OAI收割 MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: - Yang, Fan; Zhang, Liang; Liu, Zhi-quan; Zhong, Su Juan; Ma, Jia; Bao, Li 收藏  |  浏览/下载：36/0  |  提交时间：2017/08/17 Sn-58Bi solder  lead-free solder  microstructure   Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177 H. F. Zou; Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：23/0  |  提交时间：2013/02/05 Sn-Bi solder  Void  Cu3Sn  Bi segregation  Interfacial embrittlement  Cu  alloys  solder interconnect  grain-boundaries  single-crystal  bismuth  embrittlement  segregation  copper  strength   Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface 期刊论文  OAI收割 Journal of Electronic Materials, 2011, 卷号: 40, 期号: 11, 页码: 2320-2328 Q. K. Zhang; H. F. Zou; Z. F. Zhang 收藏  |  浏览/下载：22/0  |  提交时间：2012/04/13 Sn-Bi solder  Bi segregation  interfacial embrittlement  substrate  alloying  reflow temperature  tensile strength  lead-free solders  joints  microstructure  embrittlement  interconnect  bismuth  ag   In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 6, 页码: 2686-2693 Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：12/0  |  提交时间：2012/04/13 In situ observation  Shear  Creep-fatigue  Fracture  Sn-58Bi solder  Grain-boundary sliding  lead-free solders  sn-bi  microstructure evolution  tensile properties  alloys  deformation  technology  metals  ag   Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745 作者:  Kang T Y;  Xiu Y Y;  Hui L;  Wang J J;  Tong W P   |  收藏  |  浏览/下载：13/0  |  提交时间：2021/02/26 SN-AG  CU SUBSTRATE  INTERFACIAL REACTIONS  MICROSTRUCTURE  COPPER  BI  TEMPERATURE  STRENGTH  ALLOYS  JOINTS  Solder  Interfacial reaction  Intermetallics  Kinetics   Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate 期刊论文  OAI收割 Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 207-214 H. F. Zou; Z. F. Zhang 收藏  |  浏览/下载：17/0  |  提交时间：2012/04/13 Ag single crystal substrate  Lead-free solder  Intermetallic compounds  (IMCs)  Growth kinetics  Local cracks  lead-free solders  electroless ni(p) metallization  intermetallic  compound  cu-sn  joints  ni  bi  nanoindentation  microstructure  wt.percent   Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文  OAI收割 Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129 H. F. Zou; Z. F. Zhang 收藏  |  浏览/下载：25/0  |  提交时间：2012/04/13 Sn-Ag-Zn  lead-free solder  gravity  interfaces  intermetallic compounds  lead-free solders  cu substrate  bump metallization  tensile properties  phase-equilibria  eutectic alloy  ni  behavior  bi  microstructure   Current-induced phase partitioning in eutectic indium-tin pb-free solder interconnect 期刊论文  OAI收割 Journal of Electronic Materials, 2007, 卷号: 36, 期号: 10, 页码: 1372-1377 J. P. Daghfal; J. K. Shang 收藏  |  浏览/下载：6/0  |  提交时间：2012/04/13 in-Sn solder  electromigration  current stressing  hillocks  interface  mechanical-properties  microstructure  joints  electromigration  creep  bi   Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure 期刊论文  OAI收割 Journal of Electronic Materials, 2005, 卷号: 34, 期号: 1, 页码: 62-67 Q. L. Zeng; Z. G. Wang; A. P. Xian; J. K. Shang 收藏  |  浏览/下载：31/0  |  提交时间：2012/04/14 lead-free solder  low-cycle fatigue  cyclic softening  Sn-3.8Ag-0.7Cu  alloy  sn-ag-cu  fatigue behavior  bi