中国科学院机构知识库网格系统: 检索

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	Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文 OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 8 作者: Yang, Jie; Zhang, Qingke; Song, Zhenlun \| 收藏 \| 浏览/下载：146/0 \| 提交时间：2021/02/02 SnBi solder Ag and In addition microhardness nano-indentation impact toughness fracture mechanism
	First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu3Sn(010) 期刊论文 OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2010, 卷号: 26, 期号: 12, 页码: 1057-1062 作者: Pang, X. Y.; Liu, Z. Q.; Wang, S. Q.; Shang, J. K. \| 收藏 \| 浏览/下载：11/0 \| 提交时间：2021/02/02 First-principles calculation Segregation Bismuth Interface SnBi solder
	First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu(3)Sn(010) 期刊论文 OAI收割 Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 12, 页码: 1057-1062 X. Y. Pang; Z. Q. Liu; S. Q. Wang; J. K. Shang 收藏 \| 浏览/下载：26/0 \| 提交时间：2012/04/13 First-principles calculation Segregation Bismuth Interface SnBi solder reactive interface cu3sn cu growth principles fracture crystal bismuth joints copper
	TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface 期刊论文 OAI收割 Journal of Electronic Materials, 2009, 卷号: 38, 期号: 12, 页码: 2579-2584 P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang 收藏 \| 浏览/下载：26/0 \| 提交时间：2012/04/13 Intermetallic compound (IMC) SnBi solder interface diffusion growth mechanism reactive interface solder joints molten sn cu-sn technology kinetics
	Bi segregation at interface of the eutectic SnBi/Cu solder joint 期刊论文 OAI收割 ACTA METALLURGICA SINICA, 2005, 卷号: 41, 期号: 8, 页码: 847-852 作者: Liu, CZ; Zhang, W; Sui, ML; Shang, JK \| 收藏 \| 浏览/下载：12/0 \| 提交时间：2021/02/02 eutectic SnBi/Cu solder joint segregation interfacial reaction Pb-free solder