机构

• 金属研究所 [11]
• 上海微系统与信息技术... [1]

采集方式

• OAI收割 [12]

内容类型

• 期刊论文 [11]
• 学位论文 [1]

发表日期

• 2018 [1]
• 2017 [1]
• 2014 [1]
• 2013 [1]
• 2012 [2]
• 2009 [2]
• 更多

学科主题

• Materials ... [2]
• Chemistry,... [1]
• Engineerin... [1]
• Metallurgy... [1]
• Physics, A... [1]

筛选

浏览/检索结果: 共12条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314 作者:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ   |  收藏  |   Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348 Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu 收藏  |   Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文  OAI收割 Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933 H. Zhang; Q. S. Zhu; Z. Q. Liu; L. Zhang; H. Y. Guo; C. M. Lai 收藏  |   Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint 期刊论文  OAI收割 Journal of Materials Science & Technology, 2013, 卷号: 29, 期号: 1, 页码: 7-12 H. F. Zhou; J. D. Guo; Q. S. Zhu; J. K. Shang 收藏  |   Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys 期刊论文  OAI收割 Journal of Electronic Materials, 2012, 卷号: 41, 期号: 11, 页码: 3161-3168 H. F. Zhou; J. D. Guo; J. K. Shang 收藏  |   FeNiP化学镀层的制备及其与无铅焊料的润湿性及界面反应性能 学位论文  OAI收割 博士, 北京: 中国科学院金属研究所, 2012 周海飞 收藏  |   Current-induced growth of P-rich phase at electroless nickel/Sn interface 期刊论文  OAI收割 Journal of Materials Research, 2009, 卷号: 24, 期号: 9, 页码: 2767-2774 Q. L. Yang; P. J. Shang; J. D. Guo; Z. Q. Liu; J. K. Shang 收藏  |   Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect 期刊论文  OAI收割 Journal of Electronic Materials, 2009, 卷号: 38, 期号: 3, 页码: 425-429 X. F. Zhang; J. D. Guo; J. K. Shang 收藏  |   Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint 期刊论文  OAI收割 Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417 H. F. Zou; Q. S. Zhu; Z. F. Zhang 收藏  |   Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文  OAI收割 Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129 H. F. Zou; Z. F. Zhang 收藏  |