中国科学院机构知识库网格系统: 检索

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	48 48 pixelated addressable full-color micro display based on flip-chip micro LEDs 期刊论文 OAI收割 Applied Optics, 2019, 卷号: 58, 期号: 31, 页码: 8383-8389 作者: Y.Li; J.Tao; Y.Zhao; J.Wang; J.Lv \| 收藏 \| 浏览/下载：25/0 \| 提交时间：2020/08/24 Light emitting diodes,Color,Etching,Flip chip devices,Pixels,Substrates
	Enhanced Light Extraction of Flip-Chip Mini-LEDs with Prism-Structured Sidewall 期刊论文 OAI收割 Nanomaterials, 2019, 卷号: 9, 期号: 3, 页码: 8 作者: B.Tang; J.Miao; Y.C.Liu; H.Wan; N.Li \| 收藏 \| 浏览/下载：18/0 \| 提交时间：2020/08/24 flip-chip mini-LED,prism-structured sidewall,waveguide photons,light,extraction,emitting-diodes,gan,efficiency,performance,improvement,surface,Science & Technology - Other Topics,Materials Science
	Photoelectric Characteristics of Micro Flip-Chip AlGaInP Light Emitting Diode Array 期刊论文 OAI收割 Guangxue Xuebao/Acta Optica Sinica, 2018, 卷号: 38, 期号: 9 作者: Ban, Zhang; Liang, Jingqiu; Lu, Jinguang; Li, Yang \| 收藏 \| 浏览/下载：47/0 \| 提交时间：2019/09/17 Flip chip devices Aluminum alloys Copper Diodes Energy utilization Gallium alloys Heat convection Heat resistance III-V semiconductors Indium alloys Light emitting diodes Microchannels Numerical methods Optical devices Photoelectricity Polydimethylsiloxane Semiconductor alloys Silicones Temperature
	Effect of Dielectric Distributed Bragg Reflector on Electrical and Optical Properties of GaN-Based Flip-Chip Light-Emitting Diodes 期刊论文 OAI收割 Micromachines, 2018, 卷号: 9, 期号: 12, 页码: 9 作者: Zhou, S. J.; Xu, H. H.; Liu, M. L.; Liu, X. T.; Zhao, J. \| 收藏 \| 浏览/下载：19/0 \| 提交时间：2019/09/17 flip-chip light-emitting diodes distributed Bragg reflector light output power external quantum efficiency quantum-well p-type leds performance wavelength contacts ito/dbr laser power fabrication Science & Technology - Other Topics Instruments & Instrumentation
	Light-extraction enhancement of freestanding GaN-based flip-chip light-emitting diodes using two-step roughening methods 期刊论文 OAI收割 Journal of Semiconductors, 2013, 期号: 11, 页码: 53-56 作者: An TL(安铁雷); Sun B(孙波); Wei TB(魏同波); Zhao LX(赵丽霞); Duan RF(段瑞飞) 收藏 \| 浏览/下载：20/0 \| 提交时间：2015/12/25 freestanding GaN flip chip LED CsCl wet etching light extraction
	Optimized design on high-power GaN-based Micro-LEDs - art. no. 684108 会议论文 OAI收割 conference on solid state lighting and solar energy technologies, beijing, peoples r china, nov 12-14, 2007 Fan, JM; Wang, LC; Guo, JX; Yi, XY; Liu, ZQ; Wang, GH; Li, JM 收藏 \| 浏览/下载：35/0 \| 提交时间：2010/03/09 GaN-based LED Micro-LEDs light extraction efficiency ray tracing flip-chip
	Mechanical properties of arrayed Pb-free tin bump and its interfacial reaction with Ni-PUBM during reflow process 期刊论文 OAI收割 ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, 页码: 51-54 Zhu, DP; Le, L 收藏 \| 浏览/下载：16/0 \| 提交时间：2012/03/24 INTERMETALLIC COMPOUND FORMATION FLIP-CHIP TECHNOLOGY SN-3.5AG SOLDER AG SOLDER METALLIZATION RELIABILITY
	Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging 期刊论文 OAI收割 JOURNAL OF MATERIALS SCIENCE, 2006, 卷号: 41, 期号: 8, 页码: 2359-2364 Xia, YH; Xie, XM; Xie, XM; Lu, CY 收藏 \| 浏览/下载：33/0 \| 提交时间：2012/03/24 FLIP-CHIP TECHNOLOGY INTERFACIAL MICROSTRUCTURE SNAGCU SOLDER TIN-LEAD GROWTH JOINTS COPPER
	Thermal analysis for multichip module using computational fluid dynamic simulation 期刊论文 OAI收割 PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), 2004, 页码: 326-330 Cheng, YJ; Zhu, WJ; Zhu, R; Xu, GW; Luo, L 收藏 \| 浏览/下载：19/0 \| 提交时间：2012/03/24 FLIP-CHIP CFD CODE OPTIMIZATION PACKAGES DESIGN TOOL