中国科学院机构知识库网格系统: 检索

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	Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints 期刊论文 OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 20, 页码: 18524-18538 作者: Wang, Z.; Zhang, Q. K.; Chen, Y. X.; Song, Z. L. \| 收藏 \| 浏览/下载：27/0 \| 提交时间：2019/12/18 MECHANICAL-PROPERTIES INTERFACIAL EMBRITTLEMENT TENSILE PROPERTIES SEGREGATION MICROSTRUCTURE TEMPERATURE SUBSTRATE BISMUTH BEHAVIOR GROWTH
	The effect of Al on the 475 degrees C embrittlement of Fe-Cr alloys 期刊论文 OAI收割 Computational Materials Science, 2013, 卷号: 74, 页码: 101-106 W. Li; S. Lu; Q. M. Hu; H. H. Mao; B. Johansson; L. Vitos 收藏 \| 浏览/下载：28/0 \| 提交时间：2013/12/24 Ab initio 475 degrees C embrittlement Stainless steel Interfacial energy Phase separation phase-separation kinetics stainless-steels system
	Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文 OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177 H. F. Zou; Q. K. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：23/0 \| 提交时间：2013/02/05 Sn-Bi solder Void Cu3Sn Bi segregation Interfacial embrittlement Cu alloys solder interconnect grain-boundaries single-crystal bismuth embrittlement segregation copper strength
	Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface 期刊论文 OAI收割 Journal of Electronic Materials, 2011, 卷号: 40, 期号: 11, 页码: 2320-2328 Q. K. Zhang; H. F. Zou; Z. F. Zhang 收藏 \| 浏览/下载：22/0 \| 提交时间：2012/04/13 Sn-Bi solder Bi segregation interfacial embrittlement substrate alloying reflow temperature tensile strength lead-free solders joints microstructure embrittlement interconnect bismuth ag
	Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature 期刊论文 OAI收割 Journal of Materials Research, 2011, 卷号: 26, 期号: 3, 页码: 449-454 H. F. Zou; Q. K. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：20/0 \| 提交时间：2012/04/13 solder joints interfacial embrittlement single-crystal interconnect segregation tensile bismuth
	Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate 期刊论文 OAI收割 Journal of Materials Research, 2010, 卷号: 25, 期号: 2, 页码: 303-314 Q. K. Zhang; H. F. Zou; Z. F. Zhang 收藏 \| 浏览/下载：29/0 \| 提交时间：2012/04/13 interfacial embrittlement mechanical-properties grain-boundaries sn-3.5ag solders bismuth solder copper segregation metallization interconnect strength
	Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate 期刊论文 OAI收割 Scripta Materialia, 2009, 卷号: 61, 期号: 3, 页码: 308-311 H. F. Zou; Q. K. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：17/0 \| 提交时间：2012/04/13 Bi interfacial segregation Embrittlement Pb-free solder Interfacial strength Soldering copper grain-boundaries fracture boron chemistry ni3al
	Bismuth redistribution induced by intermetallic compound growth in SnBi/Cu microelectronic interconnect 期刊论文 OAI收割 Journal of Materials Science, 2009, 卷号: 44, 期号: 1, 页码: 149-153 C. Liu; W. Zhang 收藏 \| 浏览/下载：31/0 \| 提交时间：2012/04/13 lead-free solders interfacial reactions copper segregation embrittlement