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浏览/检索结果: 共193条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions 期刊论文  OAI收割 MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16 作者:  Gao, Zhaoqing;  Wang, Chen;  Chai, Zhenbang;  Chen, Yinbo;  Shen, Chenyu   |  收藏  |  浏览/下载：32/0  |  提交时间：2022/07/14 Intermetallics  Microstructure  Temperature gradient  Preferred orientation   Ga-21-5In-10Sn alloys   Interfaces   Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2020, 卷号: 56, 期号: 10, 页码: 1433-1440 作者:  Jiang Lin;  Zhang Liang;  Liu Zhiquan   |  收藏  |  浏览/下载：13/0  |  提交时间：2021/02/02 diffusion welding  Al interlayer  Ni(V) transition layer  welding residual stress  Co target  finite element simulation   The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6 作者:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin   |  收藏  |  浏览/下载：30/0  |  提交时间：2021/02/02 Co sputtering target  Soldering assembly  Interface  IMC  Growth mechanism   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：11/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：11/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Development and Test Results of a Full-Size Joint Sample for the CFETR Central Solenoid Model Coil 期刊论文  OAI收割 IEEE TRANSACTIONS ON PLASMA SCIENCE, 2020, 卷号: 48 作者:  Ma, Guanghui;  Wu, Yu;  Qin, Jinggang;  Liu, Huajun;  Hao, Qiangwang   |  收藏  |  浏览/下载：43/0  |  提交时间：2020/10/26 Conductors  Welding  Cable shielding  Resistance  Steel  Soldering  Silver  Cable-in-conduit conductor (CICC)  central solenoid model coil (CSMC)  Chinese Fusion Engineering Testing Reactor (CFETR)  dc resistance  joint   Fabrication and Test of Diameter 35 mm Iron-Based Superconductor Coils 期刊论文  OAI收割 IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2020, 卷号: 30 作者:  Zhang, Zhan;  Wang, Dongliang;  Liu, Fang;  Jiange, Donghui;  Wei, Shaoqing   |  收藏  |  浏览/下载：53/0  |  提交时间：2020/11/26 Coils  Heat treatment  Soldering  Critical current density (superconductivity)  Yttrium barium copper oxide  Copper  Critical current  High field  Iron-based superconductor  IBS application   Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390 作者:  Zhang, Qingke;  Hu, Fangqin;  Song, Zhenlun   |  收藏  |  浏览/下载：47/0  |  提交时间：2020/12/16 LEAD-FREE SOLDERS  INTERMETALLIC COMPOUNDS  LIQUID SN  KINETICS  GROWTH  CU6SN5  METALLIZATION   Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414 作者:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：11/0  |  提交时间：2021/02/02 Co target assembly  Solder  Residual stress  Simulation  Taguchi method  Optimal design   Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414 作者:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：5/0  |  提交时间：2021/02/02 Co target assembly  Solder  Residual stress  Simulation  Taguchi method  Optimal design