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	The effect of finish layer on the interfacial cracking failure of Au-Si bonding 期刊论文 OAI收割 ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8 作者: Gao, Li-Yin; Wen, Jian; Li, Cai-Fu; Chen, Chunhuan; Liu, Zhi-Quan \| 收藏 \| 浏览/下载：14/0 \| 提交时间：2021/02/02 AuSi bonding NiCo Intermetallic compounds (IMCs) Failure analysis Crack
	Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文 OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314 作者: Gao, LY; Zhang, H; Li, CF; Guo, JD; Liu, ZQ \| 收藏 \| 浏览/下载：37/0 \| 提交时间：2018/12/25 Fe-Ni under bump metallization (UBM) Intermetallic compounds (IMCs) Electromigration (EM) Diffusion Vacancy formation
	Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate 期刊论文 OAI收割 Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 207-214 H. F. Zou; Z. F. Zhang 收藏 \| 浏览/下载：17/0 \| 提交时间：2012/04/13 Ag single crystal substrate Lead-free solder Intermetallic compounds (IMCs) Growth kinetics Local cracks lead-free solders electroless ni(p) metallization intermetallic compound cu-sn joints ni bi nanoindentation microstructure wt.percent
	Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints 期刊论文 OAI收割 Journal of Electronic Materials, 2009, 卷号: 38, 期号: 6, 页码: 852-859 Q. K. Zhang; H. F. Zou; Z. F. Zhang 收藏 \| 浏览/下载：44/0 \| 提交时间：2012/04/13 Lead-free solders interface intermetallic compounds (IMCs) fatigue crack fractography intermetallic compound deformation-behavior cu microstructure evolution growth 96.5sn-3.5ag temperature interfaces morphology
	Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint 期刊论文 OAI收割 Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417 H. F. Zou; Q. S. Zhu; Z. F. Zhang 收藏 \| 浏览/下载：19/0 \| 提交时间：2012/04/13 Ag single crystal substrate Sn-3.8Ag-0.7Cu solder intermetallic compounds (IMCs) growth kinetics tensile strength fracture lead-free solder interfacial reaction cu-substrate microstructure metallization sn-3.5ag bump ni strength pb
	Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals 期刊论文 OAI收割 Acta Materialia, 2008, 卷号: 56, 期号: 11, 页码: 2649-2662 H. F. Zou; H. J. Yang; Z. F. Zhang 收藏 \| 浏览/下载：18/0 \| 提交时间：2012/04/13 Cu single crystal orientation intermetallic compounds (IMCs) coarsening mechanism growth kinetics lead-free solders interfacial reactions eutectic snpb joints microstructure sn-3.5ag sn-0.7cu copper
	Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07. 期刊论文 OAI收割 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 卷号: 435, 页码: 588-594 作者: Zhu, Q. S.; Zhang, Z. F.; Shang, J. K.; Wang, Z. G. \| 收藏 \| 浏览/下载：14/0 \| 提交时间：2021/02/02 Sn-Ag-Cu solder copper single crystal intermetallic compounds (IMCs) interface cyclic deformation persistent slip bands (PSBs) fatigue cracking
	Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07 期刊论文 OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2006, 卷号: 435, 页码: 588-594 Q. S. Zhu; Z. F. Zhang; J. K. Shang; Z. Wang 收藏 \| 浏览/下载：37/0 \| 提交时间：2012/04/14 Sn-Ag-Cu solder copper single crystal intermetallic compounds (IMCs) interface cyclic deformation persistent slip bands (PSBs) fatigue cracking persistent slip bands pb-free solders intermetallic compounds cyclic deformation joints behavior growth microstructure evolution strength