机构

• 金属研究所 [7]
• 数学与系统科学研究院 [2]
• 地理科学与资源研究所 [1]
• 心理研究所 [1]
• 上海微系统与信息技术... [1]

采集方式

• OAI收割 [12]

内容类型

• 期刊论文 [11]
• SCI/SSCI论文 [1]

发表日期

• 2021 [2]
• 2018 [2]
• 2017 [1]
• 2016 [1]
• 2014 [2]
• 2013 [1]
• 更多

学科主题

• Chemistry,... [1]
• Materials ... [1]
• Metallurgy... [1]
• Physics, M... [1]

筛选

浏览/检索结果: 共12条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Charting the human amygdala development across childhood and adolescence: Manual and automatic segmentation 期刊论文  OAI收割 DEVELOPMENTAL COGNITIVE NEUROSCIENCE, 2021, 卷号: 52, 页码: 16 作者:  Zhou, Quan;  Liu, Siman;  Jiang, Chao;  He, Ye;  Zuo, Xi-Nian   |  收藏  |  浏览/下载：86/0  |  提交时间：2021/12/27 Amygdala  Brain development  Growth chart  MRI  Reliability   A Reliability Growth Process Model with Time-Varying Covariates and Its Application 期刊论文  OAI收割 MATHEMATICS, 2021, 卷号: 9, 期号: 8, 页码: 15 作者:  Tian, Xin-Yu;  Shi, Xincheng;  Peng, Cheng;  Yi, Xiao-Jian   |  收藏  |  浏览/下载：31/0  |  提交时间：2021/06/01 AMSAA model  reliability growth  covariate effects  maximum likelihood  statistical inference   The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642 作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ   |  收藏  |  浏览/下载：39/0  |  提交时间：2018/06/05 Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength   Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 10, 页码: 1885-1890 作者:  Sun FuLong;  Gao LiYin;  Liu ZhiQuan;  Zhang Hao;  Sugahara Tohru   |  收藏  |  浏览/下载：22/0  |  提交时间：2021/02/02 NI SOLDER JOINTS  NANO-SCALE TWINS  INTERFACIAL RELIABILITY  FE-NI  COPPER  METALS  DEFORMATION  STRENGTH  DEPENDENCE  BOUNDARIES  Electrodeposition  Nanotwinned Cu  Growth mechanism  Acid adsorption   An Approach for Reliability Demonstration Test Based on Power-Law Growth Model 期刊论文  OAI收割 QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL, 2017, 卷号: 33, 期号: 8, 页码: 1719-1730 作者:  Xu, J. Y.;  Yu, D.;  Xie, M.;  Hu, Q. P.   |  收藏  |  浏览/下载：220/0  |  提交时间：2018/07/30 reliability growth  reliability demonstration test  power-law growth model  fiducial distribution   Effects of functional diversity loss on ecosystem functions are influenced by compensation SCI/SSCI论文  OAI收割 2016 作者:  Pan Q. M.;  Tian, D. S.;  Naeem, S.;  Auerswald, K.;  Elser, J. J.   |  收藏  |  浏览/下载：37/0  |  提交时间：2017/11/09 biodiversity  ecosystem functioning  grassland ecosystem  multifunctionality  plant functional group  removal experiment  plant-species richness  removal experiment  current knowledge  group  identity  clonal growth  biodiversity  productivity  grassland  communities  reliability   Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文  OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355 F. F. Tian; Z. Q. Liu; P. J. Shang; J. D. Guo 收藏  |  浏览/下载：29/0  |  提交时间：2014/04/18 Phase identification  Interface  IMC  Eutectic SnIn solder  Single  crystalline Cu  gamma-angular correlations  lead-free solders  joint reliability  growth-kinetics  system  equilibria  mechanisms  interfaces  diffusion  layer   Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文  OAI收割 Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933 H. Zhang; Q. S. Zhu; Z. Q. Liu; L. Zhang; H. Y. Guo; C. M. Lai 收藏  |  浏览/下载：34/0  |  提交时间：2015/01/14 Fe-Ni alloy  Under bump metallization (UBM)  Intermetallic compound  (IMC)  Reliability  High temperature storage  Temperature cycling  lead-free solders  intermetallic compounds  growth-kinetics  cu  metallization  ag  strength  ball  ubm   Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文  OAI收割 Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558 L. M. Yang; Z. F. Zhang 收藏  |  浏览/下载：26/0  |  提交时间：2013/12/24 Lead-free solder  intermetallic compounds  interfacial reaction  grain  growth  sn-ag-cu  shear-strength  mechanical-properties  rare-earth  bga joints  alloy  electromigration  reliability   Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging 期刊论文  OAI收割 Philosophical Magazine Letters, 2011, 卷号: 91, 期号: 6, 页码: 410-417 P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang 收藏  |  浏览/下载：23/0  |  提交时间：2012/04/13 diffusion  intermetallic compounds  SnIn solder  interfaces  Kirkendall  void  cu-sn  interface  reliability  diffusion  systems  growth