机构

• 金属研究所 [7]
• 数学与系统科学研究院 [2]
• 地理科学与资源研究所 [1]
• 心理研究所 [1]
• 上海微系统与信息技术... [1]

采集方式

• OAI收割 [12]

内容类型

• 期刊论文 [11]
• SCI/SSCI论文 [1]

发表日期

• 2021 [2]
• 2018 [2]
• 2017 [1]
• 2016 [1]
• 2014 [2]
• 2013 [1]
• 更多

学科主题

• Chemistry,... [1]
• Materials ... [1]
• Metallurgy... [1]
• Physics, M... [1]

筛选

浏览/检索结果: 共12条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Charting the human amygdala development across childhood and adolescence: Manual and automatic segmentation 期刊论文  OAI收割 DEVELOPMENTAL COGNITIVE NEUROSCIENCE, 2021, 卷号: 52, 页码: 16 作者:  Zhou, Quan;  Liu, Siman;  Jiang, Chao;  He, Ye;  Zuo, Xi-Nian   |  收藏  |   A Reliability Growth Process Model with Time-Varying Covariates and Its Application 期刊论文  OAI收割 MATHEMATICS, 2021, 卷号: 9, 期号: 8, 页码: 15 作者:  Tian, Xin-Yu;  Shi, Xincheng;  Peng, Cheng;  Yi, Xiao-Jian   |  收藏  |   The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642 作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ   |  收藏  |   Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 10, 页码: 1885-1890 作者:  Sun FuLong;  Gao LiYin;  Liu ZhiQuan;  Zhang Hao;  Sugahara Tohru   |  收藏  |   An Approach for Reliability Demonstration Test Based on Power-Law Growth Model 期刊论文  OAI收割 QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL, 2017, 卷号: 33, 期号: 8, 页码: 1719-1730 作者:  Xu, J. Y.;  Yu, D.;  Xie, M.;  Hu, Q. P.   |  收藏  |   Effects of functional diversity loss on ecosystem functions are influenced by compensation SCI/SSCI论文  OAI收割 2016 作者:  Pan Q. M.;  Tian, D. S.;  Naeem, S.;  Auerswald, K.;  Elser, J. J.   |  收藏  |   Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文  OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355 F. F. Tian; Z. Q. Liu; P. J. Shang; J. D. Guo 收藏  |   Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文  OAI收割 Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933 H. Zhang; Q. S. Zhu; Z. Q. Liu; L. Zhang; H. Y. Guo; C. M. Lai 收藏  |   Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文  OAI收割 Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558 L. M. Yang; Z. F. Zhang 收藏  |   Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging 期刊论文  OAI收割 Philosophical Magazine Letters, 2011, 卷号: 91, 期号: 6, 页码: 410-417 P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang 收藏  |