中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
机构
采集方式
内容类型
发表日期
学科主题
筛选

浏览/检索结果: 共37条,第1-10条 帮助

条数/页: 排序方式:
Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state 期刊论文  OAI收割
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 4, 页码: 2967-2975
作者:  
Du, Yahong;  Gao, Li-Yin;  Yu, Daquan;  Liu, Zhi-Quan
  |  收藏  |  浏览/下载:15/0  |  提交时间:2021/02/03
Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications 会议论文  OAI收割
作者:  
Chen C(陈诚);  Teng Wang;  Wan LX(万里兮);  Yu DQ(于大全);  Shuying Ma
  |  收藏  |  浏览/下载:36/0  |  提交时间:2019/05/15
Imparting designer biorecognition functionality to metal-organic frameworks by a dna-mediated surface engineering strategy 期刊论文  iSwitch采集
Small, 2018, 卷号: 14, 期号: 11, 页码: 8
作者:  
Ning, Weiyu;  Di, Zhenghan;  Yu, Yingjie;  Zeng, Pingmei;  Di, Chunzhi
收藏  |  浏览/下载:111/0  |  提交时间:2019/04/23
Mode splitting induced by an arbitrarily shaped Rayleigh scatterer in a whispering-gallery microcavity 期刊论文  OAI收割
Physical Review A, 2018, 卷号: 97, 期号: 6, 页码: 063828
作者:  
Yinglun Xu;   Shui-Jing Tang;   Xiao-Chong Yu;   You-Ling Chen;   Daquan Yang;   Qihuang Gong;   Yun-Feng Xiao
  |  收藏  |  浏览/下载:22/0  |  提交时间:2019/11/12
以硅通孔为核心的三维系统集成技术及应用 成果  OAI收割
2018
主要完成人:  
孙鹏;  戴风伟;  肖智轶;  于大全;  张文奇
  |  收藏  |  浏览/下载:46/0  |  提交时间:2019/05/24
High Frequency Characterization and Analysis of Through Silicon Vias and Coplanar 期刊论文  OAI收割
Microsystem Technologies, 2014
作者:  
Yu DQ(于大全);  Wang HJ(王惠娟)
  |  收藏  |  浏览/下载:7/0  |  提交时间:2015/04/22
带散热功能的三维堆叠芯片的制造方法 专利  OAI收割
申请日期: 2014-03-10,
作者:  
张迪;  谢慧琴;  于大全;  曹立强;  吴晓萌
  |  收藏  |  浏览/下载:9/0  |  提交时间:2017/05/24
Multifunctional Layered Gadolinium Hydroxide Nanoplates for Ultrahigh Field Magnetic Resonance Imaging, Computed Tomography and Fluorescence Bioimaging 期刊论文  OAI收割
JOURNAL OF BIOMEDICAL NANOTECHNOLOGY, 2014
作者:  
Wu, Min;  Li, Lei;  Yu, Xuefeng;  Zhang, Daquan;  Sun, Tianying
收藏  |  浏览/下载:27/0  |  提交时间:2015/09/02
Novel spray coating process with polymer material applied in CIS wafer-level-packaging 会议论文  OAI收割
2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014, Singapore, Singapore
作者:  
Yuechen Zhuang;  Daquan Yu;  Fengwei Dai;  Zhongcai Niu;  Wenqi Zhang
收藏  |  浏览/下载:37/0  |  提交时间:2015/09/01
Spray coating process with polymer material for insulation in CIS-TSV wafer-level-packaging 会议论文  OAI收割
2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, Chengdu, China
作者:  
Yuechen Zhuang;  Daquan Yu
收藏  |  浏览/下载:41/0  |  提交时间:2015/09/01