机构

• 金属研究所 [10]

采集方式

• OAI收割 [10]

内容类型

• 期刊论文 [10]

发表日期

• 2014 [2]
• 2012 [1]
• 2011 [2]
• 2010 [2]
• 2009 [3]

学科主题

筛选

浏览/检索结果: 共10条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate 期刊论文  OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667 F. F. Tian; Z. Q. Liu 收藏  |   Phase transformation between Cu(In,Sn)(2) and Cu-2(In,Sn) compounds formed on single crystalline Cu substrate during solid state aging 期刊论文  OAI收割 Journal of Applied Physics, 2014, 卷号: 115, 期号: 4 F. F. Tian; Z. Q. Liu; J. D. Guo 收藏  |   Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177 H. F. Zou; Q. K. Zhang; Z. F. Zhang 收藏  |   Effects of Bi segregation on the tensile properties of Cu/Cu(3)Sn(100) interface 期刊论文  OAI收割 Microelectronics Reliability, 2011, 卷号: 51, 期号: 12, 页码: 2330-2335 X. Y. Pang; Z. Q. Liu; S. Q. Wang; J. K. Shang 收藏  |   Fracture behaviors and strength of Cu(6)Sn(5) intermetallic compounds by indentation testing 期刊论文  OAI收割 Journal of Applied Physics, 2011, 卷号: 110, 期号: 1 Q. K. Zhang; J. Tan; Z. F. Zhang 收藏  |   First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu(3)Sn(010) 期刊论文  OAI收割 Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 12, 页码: 1057-1062 X. Y. Pang; Z. Q. Liu; S. Q. Wang; J. K. Shang 收藏  |   Weakening of the Cu/Cu(3)Sn(100) Interface by Bi Impurities 期刊论文  OAI收割 Journal of Electronic Materials, 2010, 卷号: 39, 期号: 8, 页码: 1277-1282 X. Y. Pang; P. J. Shang; S. Q. Wang; Z. Q. Liu; J. K. Shang 收藏  |   Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates 期刊论文  OAI收割 ACTA MATERIALIA, 2009, 卷号: 57, 期号: 16, 页码: 4697-4706 作者:  Shang, P. J.;  Liu, Z. Q.   |  收藏  |   An ordered structure of Cu3Sn in Cu-Sn alloy investigated by transmission electron microscopy 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 卷号: 469, 期号: 1-2, 页码: 129-136 作者:  Sang, Mahan;  Du, Kui;  Ye, Hengqiang   |  收藏  |   An ordered structure of Cu3Sn in Cu-Sn alloy investigated by transmission electron microscopy 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 卷号: 469, 期号: 1-2, 页码: 129-136 作者:  Sang, Mahan;  Du, Kui;  Ye, Hengqiang   |  收藏  |