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浏览/检索结果: 共47条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文  OAI收割 MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20 作者:  Zhang, Sinan;  Wang, Zhen;  Wang, Jie;  Duan, Guihua;  Li, Haixia   |  收藏  |   Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文  OAI收割 MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20 作者:  Zhang, Sinan;  Wang, Zhen;  Wang, Jie;  Duan, Guihua;  Li, Haixia   |  收藏  |   Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 10, 页码: 1885-1890 作者:  Sun FuLong;  Gao LiYin;  Liu ZhiQuan;  Zhang Hao;  Sugahara Tohru   |  收藏  |   Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236 M. N. Wang; J. Q. Wang; W. Ke 收藏  |   In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 卷号: 25, 期号: 10, 页码: 4538—4546 Zhou, P; Kang, HJ; Cao, F; Fu, YA; Xiao, TQ; Wang, TM 收藏  |   Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384 Q. K. Zhang; Z. F. Zhang 收藏  |   Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文  OAI收割 Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558 L. M. Yang; Z. F. Zhang 收藏  |   The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy 期刊论文  OAI收割 Journal of Alloys and Compounds, 2013, 卷号: 550, 页码: 231-238 C. F. Li; Z. Q. Liu; J. K. Shang 收藏  |   Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2013, 卷号: 24, 期号: 1, 页码: 211-216 H. Y. Liu; Q. S. Zhu; Z. G. Wang; J. D. Guo; J. K. Shang 收藏  |   Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys 期刊论文  OAI收割 Journal of Electronic Materials, 2012, 卷号: 41, 期号: 11, 页码: 3161-3168 H. F. Zhou; J. D. Guo; J. K. Shang 收藏  |