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• 金属研究所 [34]
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• OAI收割 [47]

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• 期刊论文 [45]
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• 2022 [2]
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浏览/检索结果: 共47条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文  OAI收割 MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20 作者:  Zhang, Sinan;  Wang, Zhen;  Wang, Jie;  Duan, Guihua;  Li, Haixia   |  收藏  |  浏览/下载：21/0  |  提交时间：2023/02/24 Cu/SAC305/Cu solder joints  in situ tensile test  fracture analysis  X-ray mu-CT  FE simulation   Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文  OAI收割 MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20 作者:  Zhang, Sinan;  Wang, Zhen;  Wang, Jie;  Duan, Guihua;  Li, Haixia   |  收藏  |  浏览/下载：34/0  |  提交时间：2022/08/22 Cu/SAC305/Cu solder joints  in situ tensile test  fracture analysis  X-ray mu-CT  FE simulation   Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 10, 页码: 1885-1890 作者:  Sun FuLong;  Gao LiYin;  Liu ZhiQuan;  Zhang Hao;  Sugahara Tohru   |  收藏  |  浏览/下载：22/0  |  提交时间：2021/02/02 NI SOLDER JOINTS  NANO-SCALE TWINS  INTERFACIAL RELIABILITY  FE-NI  COPPER  METALS  DEFORMATION  STRENGTH  DEPENDENCE  BOUNDARIES  Electrodeposition  Nanotwinned Cu  Growth mechanism  Acid adsorption   Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236 M. N. Wang; J. Q. Wang; W. Ke 收藏  |  浏览/下载：25/0  |  提交时间：2014/04/18 lead-free solders  3.5-percent nacl solution  electrochemical corrosion  ga solder  reliability  surface  alloys  joints  tin  sn   In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 卷号: 25, 期号: 10, 页码: 4538—4546 Zhou, P; Kang, HJ; Cao, F; Fu, YA; Xiao, TQ; Wang, TM 收藏  |  浏览/下载：34/0  |  提交时间：2015/03/13 LEAD-FREE SOLDER  RARE-EARTH-ELEMENTS  SOLID-LIQUID INTERFACE  DIRECTIONAL SOLIDIFICATION  ELECTRIC-CURRENT  MOLTEN SN  MICROSTRUCTURE  JOINTS  EVOLUTION  SNAGCU   Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384 Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：21/0  |  提交时间：2013/12/24 Sn-Ag/Cu solder joints  Thermal fatigue  Strain localization  Grain  rotation  Dynamic recovery  stress-relaxation behavior  eutectic sn-3.5ag solder  lead-free solders  pb-free solders  sn-ag  tensile properties  shear-strength  fracture-behavior  deformation  creep   Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文  OAI收割 Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558 L. M. Yang; Z. F. Zhang 收藏  |  浏览/下载：26/0  |  提交时间：2013/12/24 Lead-free solder  intermetallic compounds  interfacial reaction  grain  growth  sn-ag-cu  shear-strength  mechanical-properties  rare-earth  bga joints  alloy  electromigration  reliability   The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy 期刊论文  OAI收割 Journal of Alloys and Compounds, 2013, 卷号: 550, 页码: 231-238 C. F. Li; Z. Q. Liu; J. K. Shang 收藏  |  浏览/下载：21/0  |  提交时间：2013/12/24 Tin whisker  Hillock  NdSn3  Oxidation  Growth mechanism  lead-free solder  electron-microscopy  nd addition  sn-whiskers  joints  mechanisms   Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2013, 卷号: 24, 期号: 1, 页码: 211-216 H. Y. Liu; Q. S. Zhu; Z. G. Wang; J. D. Guo; J. K. Shang 收藏  |  浏览/下载：19/0  |  提交时间：2013/12/24 intermetallic compound formation  sn-3.8ag-0.7cu solder  cu  microstructure  joints   Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys 期刊论文  OAI收割 Journal of Electronic Materials, 2012, 卷号: 41, 期号: 11, 页码: 3161-3168 H. F. Zhou; J. D. Guo; J. K. Shang 收藏  |  浏览/下载：21/0  |  提交时间：2013/02/05 Electroless Fe-Ni  under-bump metallization  interfacial reaction  lead-free solders  wetting balance  snagcu solder  cu  joints  solderability  growth  ag