机构

• 半导体研究所 [6]
• 苏州纳米技术与纳米仿... [1]
• 数学与系统科学研究院 [1]
• 上海微系统与信息技术... [1]
• 高能物理研究所 [1]
• 中国科学院大学 [1]
• 更多

采集方式

• OAI收割 [8]
• iSwitch采集 [3]

内容类型

• 期刊论文 [10]
• 会议论文 [1]

发表日期

• 2018 [1]
• 2015 [1]
• 2012 [1]
• 2011 [2]
• 2010 [1]
• 2006 [2]
• 更多

学科主题

• 光电子学 [3]
• Engineerin... [1]
• Engineerin... [1]
• 半导体材料 [1]

筛选

浏览/检索结果: 共11条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Optimization on benzocyclobutene-based CMUT fabrication with an inverse structure 期刊论文  OAI收割 SENSORS AND ACTUATORS A-PHYSICAL, 2018, 卷号: 281, 页码: 1-8 作者:  Li, Zhenhao;  Na, Shuai;  Chen, Albert I. H.;  Wong, Lawrence L. P.;  Sun, Zhendong   |  收藏  |  浏览/下载：37/0  |  提交时间：2018/11/16 Capacitive micromachined ultrasonic transducer  Adhesive wafer bonding  Photosensitive benzocyclobutene  Resonator   Micro-electro-mechanical systems capacitive ultrasonic transducer with a higher electromechanical coupling coefficient 期刊论文  OAI收割 Micro & Nano Letters, 2015, 卷号: 10, 期号: 10, 页码: 4 作者:  Miao, J(苗静);  Shen, WJ(沈文江);  He, CD;  Xue, CY;  Xiong, JJ 收藏  |  浏览/下载：84/0  |  提交时间：2015/12/31 silicon  elemental semiconductors  silicon-on-insulator  wafer bonding  electromechanical effects  ultrasonic transducers  capacitive transducers  micromechanical devices  micromachining  vibrations  membranes  finite element analysis  reliability  capacitance  electromechanical coupling coefficient  capacitive micromachined ultrasonic transducer  impedance matching  propagation medium  microelectromechanical system capacitive ultrasonic transducer  silicon on insulator  wafer bonding  optimum geometric dimensions  membrane mechanical vibration  electrical characteristics  finite-element analysis  operation mode  device safety  device reliability  equivalent stress  operation-collapse voltage  bottom electrodes  glass substrate surface  parallel parasitic capacitance  Si  SiO2   Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding 期刊论文  OAI收割 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 期号: 6, 页码: 1484-1491 Wu, GQ; Xu, DH; Xiong, B; Wang, YC; Wang, YL; Ma, YL 收藏  |  浏览/下载：107/0  |  提交时间：2013/04/23 Bulk mode  glass frit bonding  microelectromechanical systems (MEMS)  redistribution  resonators  silicon bumps  vacuum package  wafer-level package   Wavelength-tunable si-based ingaas resonant cavity enhanced photodetectors using sol-gel wafer bonding technology 期刊论文  iSwitch采集 Ieee photonics technology letters, 2011, 卷号: 23, 期号: 13, 页码: 881-883 作者:  Zhang, Lingzi;  Cao, Quan;  Zuo, Yuhua;  Xue, Chunlai;  Cheng, Buwen 收藏  |  浏览/下载：29/0  |  提交时间：2019/05/12 Resonant cavity enhanced (rce) photodetector  Silicon photonics  Sol-gel wafer bonding  Thermal tuning   Wavelength-Tunable Si-Based InGaAs Resonant Cavity Enhanced Photodetectors Using Sol-Gel Wafer Bonding Technology 期刊论文  OAI收割 ieee photonics technology letters, 2011, 卷号: 23, 期号: 13, 页码: 881-883 作者:  Cao Q 收藏  |  浏览/下载：69/5  |  提交时间：2011/07/05 Resonant cavity enhanced (RCE) photodetector  silicon photonics  sol-gel wafer bonding  thermal tuning  INTERFACIAL ENERGY  SILICON-WAFERS  HIGH-SPEED  TEMPERATURE  PHOTODIODES  MORPHOLOGY  POWER   Wafer-level vacuum packaging of micromachined thermoelectric ir sensors 期刊论文  iSwitch采集 Ieee transactions on advanced packaging, 2010, 卷号: 33, 期号: 4, 页码: 904-911 作者:  Xu, Dehui;  Jing, Errong;  Xiong, Bin;  Wang, Yuelin 收藏  |  浏览/下载：22/0  |  提交时间：2019/05/10 Au-au thermocompression bonding  Infrared sensor  Microelectromechanical systems (mems)  Optical filter  Thermoelectric  Vacuum package  Wafer-level package   Strain analysis of inp/ingaasp wafer bonded on si by x-ray double crystalline diffraction 期刊论文  iSwitch采集 Materials science and engineering b-solid state materials for advanced technology, 2006, 卷号: 133, 期号: 1-3, 页码: 117-123 作者:  Zhao, Hong-Quan;  Yu, Li-Juan;  Huang, Yong-Zhen;  Wang, Yu-Tian 收藏  |  浏览/下载：28/0  |  提交时间：2019/05/12 Inp  Si  X-ray double crystalline diffraction  Thermal strain  Wafer bonding   Strain analysis of InP/InGaAsP wafer bonded on Si by X-ray double crystalline diffraction 期刊论文  OAI收割 materials science and engineering b-solid state materials for advanced technology, 2006, 卷号: 133, 期号: 1-3, 页码: 117-123 Zhao HQ (Zhao Hong-Quan); Yu LJ (Yu Li-Juan); Huang YZ (Huang Yong-Zhen); Wang YT (Wang Yu-Tian) 收藏  |  浏览/下载：40/0  |  提交时间：2010/04/11 InP  Si  X-ray double crystalline diffraction  thermal strain  wafer bonding  OPTOELECTRONIC DEVICES  EPITAXIAL OVERGROWTHS  TEMPERATURE  INTERFACE  STRESSES  VCSELS  SURFACES  ENERGY   Wafer bonding technique used for the integration of cubic GaN/GaAs (001) with Si substrate 期刊论文  OAI收割 SCIENCE IN CHINA SERIES E-TECHNOLOGICAL SCIENCES, 2002, 卷号: 45, 期号: 3, 页码: #REF! 作者:  Sun, YP;  Fu, Y;  Qu, B;  Wang, YT;  Feng, ZH 收藏  |  浏览/下载：19/0  |  提交时间：2016/04/12 wafer bonding  cubic  GaN/GaAs(001)  Si-substrate   Wafer bonding technique used for the integration of cubic GaN/GaAs (001) with Si substrate 期刊论文  OAI收割 science in china series e-technological sciences, 2002, 卷号: 45, 期号: 3, 页码: 255-260 作者:  Zhang SM;  Zhao DG 收藏  |  浏览/下载：99/5  |  提交时间：2010/08/12 wafer bonding  cubic  GaN/GaAs(001)  Si-substrate  LIGHT-EMITTING-DIODES  P-TYPE GAN  RESISTANCE  CONTACT  LASER