机构

• 半导体研究所 [6]
• 苏州纳米技术与纳米仿... [1]
• 数学与系统科学研究院 [1]
• 上海微系统与信息技术... [1]
• 高能物理研究所 [1]
• 中国科学院大学 [1]
• 更多

采集方式

• OAI收割 [8]
• iSwitch采集 [3]

内容类型

• 期刊论文 [10]
• 会议论文 [1]

发表日期

• 2018 [1]
• 2015 [1]
• 2012 [1]
• 2011 [2]
• 2010 [1]
• 2006 [2]
• 更多

学科主题

• 光电子学 [3]
• Engineerin... [1]
• Engineerin... [1]
• 半导体材料 [1]

筛选

浏览/检索结果: 共11条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Optimization on benzocyclobutene-based CMUT fabrication with an inverse structure 期刊论文  OAI收割 SENSORS AND ACTUATORS A-PHYSICAL, 2018, 卷号: 281, 页码: 1-8 作者:  Li, Zhenhao;  Na, Shuai;  Chen, Albert I. H.;  Wong, Lawrence L. P.;  Sun, Zhendong   |  收藏  |   Micro-electro-mechanical systems capacitive ultrasonic transducer with a higher electromechanical coupling coefficient 期刊论文  OAI收割 Micro & Nano Letters, 2015, 卷号: 10, 期号: 10, 页码: 4 作者:  Miao, J(苗静);  Shen, WJ(沈文江);  He, CD;  Xue, CY;  Xiong, JJ 收藏  |   Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding 期刊论文  OAI收割 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 期号: 6, 页码: 1484-1491 Wu, GQ; Xu, DH; Xiong, B; Wang, YC; Wang, YL; Ma, YL 收藏  |   Wavelength-tunable si-based ingaas resonant cavity enhanced photodetectors using sol-gel wafer bonding technology 期刊论文  iSwitch采集 Ieee photonics technology letters, 2011, 卷号: 23, 期号: 13, 页码: 881-883 作者:   收藏  |   Wavelength-Tunable Si-Based InGaAs Resonant Cavity Enhanced Photodetectors Using Sol-Gel Wafer Bonding Technology 期刊论文  OAI收割 ieee photonics technology letters, 2011, 卷号: 23, 期号: 13, 页码: 881-883 作者:  Cao Q 收藏  |   Wafer-level vacuum packaging of micromachined thermoelectric ir sensors 期刊论文  iSwitch采集 Ieee transactions on advanced packaging, 2010, 卷号: 33, 期号: 4, 页码: 904-911 作者:  Xu, Dehui;  Jing, Errong;  Xiong, Bin;  Wang, Yuelin 收藏  |   Strain analysis of inp/ingaasp wafer bonded on si by x-ray double crystalline diffraction 期刊论文  iSwitch采集 Materials science and engineering b-solid state materials for advanced technology, 2006, 卷号: 133, 期号: 1-3, 页码: 117-123 作者:  Zhao, Hong-Quan;  Yu, Li-Juan;  Huang, Yong-Zhen;  Wang, Yu-Tian 收藏  |   Strain analysis of InP/InGaAsP wafer bonded on Si by X-ray double crystalline diffraction 期刊论文  OAI收割 materials science and engineering b-solid state materials for advanced technology, 2006, 卷号: 133, 期号: 1-3, 页码: 117-123 Zhao HQ (Zhao Hong-Quan); Yu LJ (Yu Li-Juan); Huang YZ (Huang Yong-Zhen); Wang YT (Wang Yu-Tian) 收藏  |   Wafer bonding technique used for the integration of cubic GaN/GaAs (001) with Si substrate 期刊论文  OAI收割 SCIENCE IN CHINA SERIES E-TECHNOLOGICAL SCIENCES, 2002, 卷号: 45, 期号: 3, 页码: #REF! 作者:  Sun, YP;  Fu, Y;  Qu, B;  Wang, YT;  Feng, ZH 收藏  |   Wafer bonding technique used for the integration of cubic GaN/GaAs (001) with Si substrate 期刊论文  OAI收割 science in china series e-technological sciences, 2002, 卷号: 45, 期号: 3, 页码: 255-260 作者:  Zhang SM;  Zhao DG 收藏  |