机构

• 深圳先进技术研究院 [12]

采集方式

• OAI收割 [12]

内容类型

• 会议论文 [12]

发表日期

• 2017 [1]
• 2016 [4]
• 2015 [3]
• 2014 [1]
• 2013 [2]
• 2012 [1]
• 更多

学科主题

筛选

浏览/检索结果: 共12条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序作者升序作者降序 Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文  OAI收割 Harbin, China 作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  Ching-Ping Wong   |  收藏  |  浏览/下载：22/0  |  提交时间：2018/02/02 NOVEL PERIODIC MESOPOROUS ORGANOSILICA THIN FILM WITH LOW DIELECTRIC CONSTANT AND HIGH MECHANICAL PROPERTY 会议论文  OAI收割 China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China 作者:  Jiawei Zhang;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  C. P. Wong 收藏  |  浏览/下载：22/0  |  提交时间：2017/01/15 Electroplating Fabrication and Characterization of Sn-Ag Eutectic Solder Films 会议论文  OAI收割 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者:  Jinqi Xie;  Zhe Zhong;  Kai Zhang;  Matthew M.F. Yuen;  S.W. Ricky Lee 收藏  |  浏览/下载：30/0  |  提交时间：2017/01/15 Novel low-κ ADH-based periodic mesoporous organosilica thin film for interlayer dielectric 会议论文  OAI收割 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者:  Jiawei Zhang;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  C. P. Wong 收藏  |  浏览/下载：19/0  |  提交时间：2017/01/15 Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文  OAI收割 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者:  Qiang Liu;  Guoping Zhang 收藏  |  浏览/下载：28/0  |  提交时间：2017/01/15 Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文  OAI收割 IEEE Electronic Components and Technology Conference（ECTC）, 美国 作者:  Guoping Zhang;  Kun Jiang;  Qiang Liu;  Jinhui Li;  Rong Sun 收藏  |  浏览/下载：30/0  |  提交时间：2016/01/27 Influence of rubber nanoparticles on the properties of Novolac-diazonaphthoquinone based photoresist 会议论文  OAI收割 The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China 作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  Chingping Wong 收藏  |  浏览/下载：13/0  |  提交时间：2016/01/27 Thermally conductive adhesives based on silver coated copper flake fillers 会议论文  OAI收割 The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China 作者:  Jin-Qi Xie;  Hu-Ming Ren;  Kai Zhang;  Matthew M.F.Yuen;  S.W.Ricky Lee 收藏  |  浏览/下载：15/0  |  提交时间：2016/01/27 O2 plasma treatment in polymer insulation process for through silicon vias 会议论文  OAI收割 Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国 作者:  Zhuang, Lulu;  Jiang, Kun;  Zhang, Guoping;  Tang, Jiaoning;  Sun, Rong 收藏  |  浏览/下载：30/0  |  提交时间：2015/09/01 Wetting Behavior of Polymer Liquid in Insulation Process for Through Silicon Via 会议论文  OAI收割 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China 作者:  Zhao Songfang;  Zhang Guoping;  Sun Rong;  Lee S. W. Ricky 收藏  |  浏览/下载：20/0  |  提交时间：2015/08/27