机构

• 金属研究所 [11]
• 宁波材料技术与工程研... [1]

采集方式

• OAI收割 [12]

内容类型

• 期刊论文 [12]

发表日期

• 2019 [1]
• 2012 [1]
• 2011 [2]
• 2010 [4]
• 2008 [2]
• 2007 [1]
• 更多

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浏览/检索结果: 共12条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 20, 页码: 18524-18538 作者:  Wang, Z.;  Zhang, Q. K.;  Chen, Y. X.;  Song, Z. L.   |  收藏  |   Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177 H. F. Zou; Q. K. Zhang; Z. F. Zhang 收藏  |   Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface 期刊论文  OAI收割 Journal of Electronic Materials, 2011, 卷号: 40, 期号: 11, 页码: 2320-2328 Q. K. Zhang; H. F. Zou; Z. F. Zhang 收藏  |   Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature 期刊论文  OAI收割 Journal of Materials Research, 2011, 卷号: 26, 期号: 3, 页码: 449-454 H. F. Zou; Q. K. Zhang; Z. F. Zhang 收藏  |   First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu3Sn(010) 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2010, 卷号: 26, 期号: 12, 页码: 1057-1062 作者:  Pang, X. Y.;  Liu, Z. Q.;  Wang, S. Q.;  Shang, J. K.   |  收藏  |   First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu(3)Sn(010) 期刊论文  OAI收割 Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 12, 页码: 1057-1062 X. Y. Pang; Z. Q. Liu; S. Q. Wang; J. K. Shang 收藏  |   Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate 期刊论文  OAI收割 Journal of Materials Research, 2010, 卷号: 25, 期号: 2, 页码: 303-314 Q. K. Zhang; H. F. Zou; Z. F. Zhang 收藏  |   Weakening of the Cu/Cu(3)Sn(100) Interface by Bi Impurities 期刊论文  OAI收割 Journal of Electronic Materials, 2010, 卷号: 39, 期号: 8, 页码: 1277-1282 X. Y. Pang; P. J. Shang; S. Q. Wang; Z. Q. Liu; J. K. Shang 收藏  |   Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints 期刊论文  OAI收割 Scripta Materialia, 2008, 卷号: 58, 期号: 5, 页码: 409-412 P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang 收藏  |   Inhibition of interfacial embrittlement at SnBi/Cu single crystal by electrodeposited Ag film 期刊论文  OAI收割 Journal of Materials Research, 2008, 卷号: 23, 期号: 1, 页码: 78-82 Q. S. Zhu; Z. F. Zhang; Z. G. Wang; J. K. Shang 收藏  |