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• OAI收割 [38]

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• 期刊论文 [38]

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浏览/检索结果: 共38条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11 作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：41/0  |  提交时间：2022/07/01 Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn   Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614 作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan   |  收藏  |  浏览/下载：146/0  |  提交时间：2021/02/02 alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua   |  收藏  |  浏览/下载：27/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua   |  收藏  |  浏览/下载：21/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文  OAI收割 Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596 L. M.; Zhang Yang, Z. F. 收藏  |  浏览/下载：27/0  |  提交时间：2015/05/08 Intermetallic compounds (IMC)  solder joint  cooling rate  solidification  adsorption  ag-cu solder  cu6sn5 grains  in-situ  sn  alloy  nanoparticles  ag3sn  microstructure  technology  particles   Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384 Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：21/0  |  提交时间：2013/12/24 Sn-Ag/Cu solder joints  Thermal fatigue  Strain localization  Grain  rotation  Dynamic recovery  stress-relaxation behavior  eutectic sn-3.5ag solder  lead-free solders  pb-free solders  sn-ag  tensile properties  shear-strength  fracture-behavior  deformation  creep   Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文  OAI收割 Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558 L. M. Yang; Z. F. Zhang 收藏  |  浏览/下载：26/0  |  提交时间：2013/12/24 Lead-free solder  intermetallic compounds  interfacial reaction  grain  growth  sn-ag-cu  shear-strength  mechanical-properties  rare-earth  bga joints  alloy  electromigration  reliability   Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2013, 卷号: 24, 期号: 1, 页码: 211-216 H. Y. Liu; Q. S. Zhu; Z. G. Wang; J. D. Guo; J. K. Shang 收藏  |  浏览/下载：19/0  |  提交时间：2013/12/24 intermetallic compound formation  sn-3.8ag-0.7cu solder  cu  microstructure  joints   In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction 期刊论文  OAI收割 Scripta Materialia, 2012, 卷号: 67, 期号: 3, 页码: 289-292 Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：22/0  |  提交时间：2013/02/05 Sn-4Ag solder  In situ tensile creep  Electron backscatter diffraction  (EBSD)  Polygonization  Grains subdivision  sn-ag  stress-relaxation  fracture-behavior  thermal fatigue  deformation  grain  recrystallization  microstructure  orientation  evolution   Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints 期刊论文  OAI收割 Journal of Electronic Materials, 2012, 卷号: 41, 期号: 9, 页码: 2487-2494 C. Chen; L. Zhang; J. X. Zhao; L. H. Cao; J. K. Shang 收藏  |  浏览/下载：14/0  |  提交时间：2013/02/05 Solder  size effect  shear strength  microstructure  lead-free solder  fatigue-crack initiation  sn-ag  fe-42ni  ni  cu