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• OAI收割 [35]

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• 期刊论文 [35]

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浏览/检索结果: 共35条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 4, 页码: 9 作者:  Tian, Feifei;  Pang, Xueyong;  Xu, Bo;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：36/0  |  提交时间：2021/02/02 In-48Sn solder  polycrystalline Cu  Cu-2(In  Sn)  growth orientation   Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614 作者:  Cao Lihua   |  收藏  |  浏览/下载：147/0  |  提交时间：2021/02/02 alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength   Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文  OAI收割 Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596 L. M.; Zhang Yang, Z. F. 收藏  |  浏览/下载：27/0  |  提交时间：2015/05/08 Intermetallic compounds (IMC)  solder joint  cooling rate  solidification  adsorption  ag-cu solder  cu6sn5 grains  in-situ  sn  alloy  nanoparticles  ag3sn  microstructure  technology  particles   Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384 Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：21/0  |  提交时间：2013/12/24 Sn-Ag/Cu solder joints  Thermal fatigue  Strain localization  Grain  rotation  Dynamic recovery  stress-relaxation behavior  eutectic sn-3.5ag solder  lead-free solders  pb-free solders  sn-ag  tensile properties  shear-strength  fracture-behavior  deformation  creep   Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文  OAI收割 Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558 L. M. Yang; Z. F. Zhang 收藏  |  浏览/下载：27/0  |  提交时间：2013/12/24 Lead-free solder  intermetallic compounds  interfacial reaction  grain  growth  sn-ag-cu  shear-strength  mechanical-properties  rare-earth  bga joints  alloy  electromigration  reliability   Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2013, 卷号: 24, 期号: 1, 页码: 211-216 H. Y. Liu; Q. S. Zhu; Z. G. Wang; J. D. Guo; J. K. Shang 收藏  |  浏览/下载：19/0  |  提交时间：2013/12/24 intermetallic compound formation  sn-3.8ag-0.7cu solder  cu  microstructure  joints   Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177 H. F. Zou; Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：24/0  |  提交时间：2013/02/05 Sn-Bi solder  Void  Cu3Sn  Bi segregation  Interfacial embrittlement  Cu  alloys  solder interconnect  grain-boundaries  single-crystal  bismuth  embrittlement  segregation  copper  strength   Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints 期刊论文  OAI收割 Journal of Electronic Materials, 2012, 卷号: 41, 期号: 9, 页码: 2487-2494 C. Chen; L. Zhang; J. X. Zhao; L. H. Cao; J. K. Shang 收藏  |  浏览/下载：14/0  |  提交时间：2013/02/05 Solder  size effect  shear strength  microstructure  lead-free solder  fatigue-crack initiation  sn-ag  fe-42ni  ni  cu   Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints 期刊论文  OAI收割 Scripta Materialia, 2012, 卷号: 67, 期号: 7-8, 页码: 637-640 L. M. Yang; Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：23/0  |  提交时间：2013/02/05 Solder joint  Interfaces  Intermetallic compounds  Fracture  Shear  strength  lead-free solder  brazed joints  size  sn  microstructure  deformation  reliability  failure  copper  cu   PITTING CORROSION BEHAVIOR OF Sn-0.7Cu LEAD-FREE ALLOY IN SIMULATED MARINE ATMOSPHERIC ENVIROMENT AND THE EFFECT OF TRACE Ga 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2011, 卷号: 47, 期号: 10, 页码: 1327-1334 作者:  Yan Zhong;  Xian Aiping   |  收藏  |  浏览/下载：12/0  |  提交时间：2021/02/02 Sn-0.7Cu  pitting corrosion  salt spray corrosion  lead-free solder