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• 金属研究所 [6]

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• OAI收割 [13]

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• 期刊论文 [11]
• 学位论文 [2]

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• 2010 [1]
• 2009 [3]
• 2008 [4]
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浏览/检索结果: 共13条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern 期刊论文  OAI收割 Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 12, 页码: 1143-1147 W. Liu; L. Zhang; K. J. Hsia; J. K. Shang 收藏  |  浏览/下载：27/0  |  提交时间：2012/04/13 Wetting  Reactive wetting  Spreading  Solder  Thin film pattern  Liquid  film  morphological wetting transitions  structured surfaces  eutectic snpb  films   Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect 期刊论文  OAI收割 Journal of Electronic Materials, 2009, 卷号: 38, 期号: 3, 页码: 425-429 X. F. Zhang; J. D. Guo; J. K. Shang 收藏  |  浏览/下载：17/0  |  提交时间：2012/04/13 Electromigration  coupling effect  polarity  intermetallic compound  interfacial reaction  zn based solders  ni-p/au layer  cross-interaction  intermetallic  compounds  bump metallization  eutectic snpb  sn-9zn solder  cu  joints  combination   Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device 期刊论文  OAI收割 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2009, 卷号: 32, 期号: 3, 页码: 125-132 Cao, YH; Ning, WG; Luo, L 收藏  |  浏览/下载：31/0  |  提交时间：2012/03/24 EUTECTIC SNPB  CU-SN  COPPER   Sub-100 mu m SnAg Solder Bumping Technology and the Bump Reliability 期刊论文  OAI收割 JOURNAL OF ELECTRONIC PACKAGING, 2009, 卷号: 131, 期号: 1, 页码: 11014-11014 Lin, XQ; Luo, L 收藏  |  浏览/下载：25/0  |  提交时间：2012/03/24 EUTECTIC SNPB  CU  JOINTS  ALLOYS  AG   Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu 期刊论文  OAI收割 Scripta Materialia, 2008, 卷号: 59, 期号: 3, 页码: 317-320 P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang 收藏  |  浏览/下载：24/0  |  提交时间：2012/04/13 Cu(3)Sn  growth  interface  soldering  transmission electron microscopy  (TEM)  lead-free solders  diffusion couples  snpb  bi  temperature  systems  joints  copper  phase   Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals 期刊论文  OAI收割 Acta Materialia, 2008, 卷号: 56, 期号: 11, 页码: 2649-2662 H. F. Zou; H. J. Yang; Z. F. Zhang 收藏  |  浏览/下载：22/0  |  提交时间：2012/04/13 Cu single crystal  orientation  intermetallic compounds (IMCs)  coarsening mechanism  growth kinetics  lead-free solders  interfacial reactions  eutectic snpb  joints  microstructure  sn-3.5ag  sn-0.7cu  copper   Study on Void Growth in Micro-Size SnAg Solder Bump 期刊论文  OAI收割 RARE METAL MATERIALS AND ENGINEERING, 2008, 卷号: 37, 期号: 11, 页码: 1903-1907 Lin, XQ; Luo, L 收藏  |  浏览/下载：23/0  |  提交时间：2012/03/24 EUTECTIC SNPB  TIN-LEAD  JOINTS  CU  RELIABILITY  EVOLUTION  COPPER  MICROSTRUCTURE  INTERMETALLICS  TECHNOLOGY   Void evolution in sub-100-micron Sn-Ag solder bumps during multi-reflow and aging and its effects on bonding reliability 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2008, 卷号: 37, 期号: 3, 页码: 307-313 Lin, XQ; Luo, L 收藏  |  浏览/下载：42/0  |  提交时间：2012/03/24 EUTECTIC SNPB  TIN-LEAD  JOINTS  CU  GROWTH  COPPER  MICROSTRUCTURE  INTERMETALLICS  TECHNOLOGY  MORPHOLOGY   The growth and influencing factors of voids in SnAg solder bump and their impact on interfacial bond strength 期刊论文  OAI收割 ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, 页码: 385-389 Lin, XQ; Luo, L 收藏  |  浏览/下载：24/0  |  提交时间：2012/03/24 EUTECTIC SNPB  JOINTS  CU  MICROSTRUCTURE  RELIABILITY  TECHNOLOGY  EVOLUTION   Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2006, 卷号: 435, 页码: 638-647 L. Xu; Y. Y. Cui; Y. L. Hao; R. Yang 收藏  |  浏览/下载：29/0  |  提交时间：2012/04/14 growth behavior  TiAl3 layer  Ti/Al diffusion couples  phase prediction  titanium-aluminum system  phase formation sequence  thin-film systems  ti-al system  soldering reaction  mil composites  formation rule  effective heat  eutectic snpb  tial3 layer